CN100372094C - Wafer testing device with automatic recovery function and wafer testing method - Google Patents
Wafer testing device with automatic recovery function and wafer testing method Download PDFInfo
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- CN100372094C CN100372094C CNB200410089642XA CN200410089642A CN100372094C CN 100372094 C CN100372094 C CN 100372094C CN B200410089642X A CNB200410089642X A CN B200410089642XA CN 200410089642 A CN200410089642 A CN 200410089642A CN 100372094 C CN100372094 C CN 100372094C
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- 238000011084 recovery Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 claims abstract description 33
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- 238000012956 testing procedure Methods 0.000 claims description 22
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- 238000012546 transfer Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000005856 abnormality Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 71
- 238000005516 engineering process Methods 0.000 description 8
- 238000013100 final test Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
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- 238000000280 densification Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000013101 initial test Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
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- 238000004886 process control Methods 0.000 description 1
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Abstract
一种具自动回复功能的晶片测试装置与晶片测试方法，晶片测试装置包括一主机系统、一测试系统以及一即时存取模块。主机系统是用以控管整体测试的流程，而测试系统是电性连接至主机系统，用以接收主机系统的命令百依序对多个晶粒进行测试，并对应输出多个测试数据。即时存取模块是电性连接至测试装置，用以即时记录测试数据。当测试因异常中断时，测试系统是依据即时存取模块所储存的测试数据而产生一自动回复数据，并依据自动回复数据对尚未完成测试的晶粒继续测试。此晶片测试装置与晶片测试方法可节省测试时间，并增加生产效率。
A chip testing device and a chip testing method with an automatic recovery function, the chip testing device includes a host system, a test system and a real-time access module. The host system is used to control the overall test process, and the test system is electrically connected to the host system to receive commands from the host system to test multiple chips in sequence and output multiple test data accordingly. The real-time access module is electrically connected to the test device to record the test data in real time. When the test is interrupted due to an abnormality, the test system generates an automatic recovery data based on the test data stored in the real-time access module, and continues to test the chips that have not yet completed the test based on the automatic recovery data. This chip testing device and chip testing method can save test time and increase production efficiency.
Description
Technical field
The present invention relates to a kind of wafer test apparatus and chip detecting method, and be particularly related to wafer test apparatus and chip detecting method that a kind of tool automatically replies function.
Background technology
In today of height information society, the market of multimedia application is expansion rapidly constantly, drives the trend development of electronic installation towards digitlization, networkingization, zone connectionization and use hommization simultaneously.For reaching above-mentioned requirement, must strengthen integrated circuit (Integrated Circuits, IC) requirement of each side such as the high speed processingization of element, multifunction, productive setization, miniaturization and and low priceization is so semiconductor technology is also and then towards microminiaturized, densification development.In semiconductor industry, the production of integrated circuit, mainly be divided into three phases: the encapsulation (package) of the manufacturing of wafer (wafer), the making of integrated circuit and integrated circuit etc., and when carrying out above-mentioned production stage, more comprise wafer is carried out various tests, picking out crystal grain bad on the wafer, and then guarantee technological quality and produce yield.
Wafer sort mainly can be divided into the two large divisions, is respectively that the wafer pin of following technology to carry out is surveyed and classification (wafer probe and sort), and encapsulates the final test (final test) after finishing.Wherein, it is after each road technology is finished that the wafer pin is surveyed, utilize tester table, for example the wafer pin is surveyed machine (prober), in regular turn the crystal grain on the tested wafer is tested, and uses to measure the electrical of each crystal grain, and crystal grain classified, differentiate it and be non-defective unit or defective products, the crystal grain that wherein is classified as defective products will no longer carry out follow-up technology, to save cost of manufacture.
In addition, fallback circuit is arranged and can just can carry out the action of laser preparing for itself designing for the crystal grain of repairing.At first, previous measured test data is analyzed and judged by system, to put out the repaired data of each crystal grain in order, as the position of crystal grain and the configuration of circuit etc.Afterwards, according to repairing data bad crystal grain is carried out redundant action of repairing by laser repairing (trimmer).Therefore, above-mentioned test actions such as the survey of wafer pin, laser preparing and final test implements real important key for key elements such as promoting technological quality, acceleration production efficiency in the semiconductor industry and reduce production costs.
Yet, have now when carrying out above-mentioned wafer sort steps such as the survey of wafer pin, laser preparing or final test, cause test to be interrupted sometimes because of tester table (as probe, laser repairing etc.) fault or other factors that can not expect.At this moment, the test data of having finished the crystal grain of test on the same wafer also will be along with system break thereby loss, therefore when the fault eliminating or change another tester table when proceeding to test, tester table just need be got back to the position of initial setting, and is from the beginning tested by the crystal grain that is positioned at initial test position.Thus, this kind factor needs the action of retest according to loss, may make crystal grain repeatedly wreck after the test repeatedly, and the replacement of test action also will prolong the time-histories of integrated testability, thereby cause problems such as production cost increase, production efficiency be low.
Summary of the invention
In view of this, purpose of the present invention is exactly to provide a kind of tool to automatically reply the chip detecting method of function, it is to make the test position before tester table returns back to system break when test action is interrupted for some reason and will operate again, to save testing time and cost.
Another object of the present invention is at the wafer test apparatus that provides a kind of tool to automatically reply function, and it is to continue uncompleted test action by the test position before the system break, thereby can save testing time and cost after the test interruption and operating again.
Based on above-mentioned purpose, the present invention proposes the chip detecting method that a kind of tool automatically replies function, and it at first carries out one first testing procedure, in regular turn a plurality of crystal grain on the wafer is tested, and is stored the test data of each crystal grain immediately.When test action during because of aborted, then carry out one and automatically reply data and produce step, produce one according to the test data that has stored and automatically reply data.Then, carry out one second testing procedure,, begin to continue test from the crystal grain of not finishing test as yet according to automatically replying data.
In preferred embodiment of the present invention, the first above-mentioned testing procedure is for example tested crystal grain by one first tester table, and the test data of corresponding each crystal grain of output, the while for example stores the test data of each crystal grain immediately by an immediate access module.
In preferred embodiment of the present invention, above-mentioned tool automatically replies the chip detecting method of function, wherein automatically reply data produce step after and before second testing procedure, more comprise fault eliminating step, make first tester table can normal running.
In preferred embodiment of the present invention, the second above-mentioned testing procedure for example begins continue test according to automatically replying data from the crystal grain of not finishing test as yet by first tester table.In addition, after automatically replying data generation step and before second testing procedure, more can comprise a transfer step, the product sheet is sent to one second tester table from first tester table.So, just, can utilize second tester table to begin to continue test from the crystal grain of not finishing test as yet according to automatically replying data.
Based on above-mentioned purpose, the present invention more proposes the wafer test apparatus that a kind of tool automatically replies function, it is suitable for a plurality of crystal grain on the wafer are tested, and the wafer test apparatus that this tool automatically replies function for example comprises a host computer system, a test macro and an immediate access module.Wherein, host computer system is the flow process of week with the keyholed back plate integrated testability, and test macro is to be electrically connected to host computer system, in regular turn crystal grain is tested in order to the order that receives host computer system, and a plurality of test datas of corresponding output.In addition, the immediate access module is to be electrically connected to testing apparatus, in order to the instant recording test data.When testing because of aborted, test macro is to produce one according to the stored test data of immediate access module to automatically reply data, and according to automatically replying data the crystal grain of not finishing test is as yet continued test.
In preferred embodiment of the present invention, the test macro that above-mentioned tool automatically replies the wafer test apparatus of function for example comprises a tester table and a control module.Wherein, tester table is in order to crystal grain is tested, and correspondence outputs test data, and control module is to be electrically connected to host computer system, immediate access module and tester table.In addition, control module is that the order that receives host computer system is tested with the control tester table, and correspondence outputs test data to the immediate access module.When testing because of aborted, control module more produces according to the stored test data of immediate access module and automatically replies data, uses the control tester table and continues uncompleted test.
In preferred embodiment of the present invention, above-mentioned tester table for example can be pin and surveys equipment such as machine, laser repairing.
Based on above-mentioned, the present invention proposes wafer test apparatus and the chip detecting method that a kind of tool automatically replies function, and it is to utilize an immediate access module when each crystal grain is finished test, writes down its test data immediately.When testing process interrupted for some reason and will restart to operate, control module just can be carried out one and be automatically replied data generation step, then just can carry out second testing procedure, tests according to the crystal grain that previous test data continues to finish on the wafer.After it should be noted that second testing procedure for example can be got rid of step via a fault, on the first original tester table, carry out, or can be sent to one second board and carry out via a transfer step.Automatically reply the wafer testing system and the method for testing thereof of function by tool of the present invention, can save because of test and interrupt, the time that causes restarting to test required cost, can reduce overall craft time and cost simultaneously, and then enhance productivity.
For above-mentioned and other purposes of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 illustrates the schematic diagram that automatically replies the wafer test apparatus of function for tool of the present invention.
Fig. 2 illustrates the schematic flow sheet that automatically replies the chip detecting method of function for tool of the present invention.
The reference numeral explanation
100: wafer test apparatus
110: host computer system
120: test macro
122: control module
124: tester table
130: the immediate access module
140: database
Step 10: control module receives the instruction of host computer system
Step 20: the control tester table is tested crystal grain
Step 30: tester table is passed test result back control module
Step 40: the corresponding output of control module one test data is to the immediate access module
Step 50: the immediate access module is with the test data input database
Step 60: control module reads previous stored test data
Step 70: corresponding generation one automatically replies data
Step 202: first testing procedure
Step 204: whether test action is because of interrupting unusually
Step 206: automatically reply data and produce step
Step 208: fault is got rid of step
Step 210: transfer step
Step 212: second testing procedure
Step 214: finish test
Embodiment
Tool of the present invention automatically replies the wafer test apparatus of function and chip detecting method and for example is applicable to a plurality of crystal grain on the wafer are carried out actions such as the survey of wafer pin, laser preparing or final test in the semiconductor technology.
Please refer to Fig. 1, it illustrates the schematic diagram that tool of the present invention automatically replies the wafer test apparatus of function.Wafer test apparatus 100 for example comprises a host computer system 110, a test macro (tester) 120, an immediate access module 130 and a database 140, wherein host computer system 110 for example is first-class process control (the Manufacturing Execution System of system, MES), it is the flow process in order to keyholed back plate overall chip test, comprising wafer move, the parameters such as lot number, wafer sequence number and process time of technology category, wafer batch (batch).
Refer again to Fig. 1, test macro 120 for example comprises a control module 122 and a tester table 124, wherein tester table 124 for example can be in order to the pin that carries out the survey of wafer pin and surveys machine (prober), and control module 122 is to be electrically connected to host computer system 110, immediate access module 130 and tester table 124.In addition, the instruction of control module 122 reception host computer systems 110 (after the step 10), is just controlled tester table 124 and in the mode of stepping the crystal grain on the particular wafer of given batch is tested (step 20).Wherein, after tester table 124 every pair of crystal grain are finished test, just test result is passed back control module 122 (step 30), and the just corresponding output of control module 122 one test data (step 40) to the immediate access module 130, test data with instant each crystal grain of storage, and after waiting until that all crystal grains on the same wafer is all finished test, immediate access module 130 is just with in the test data input database 140 of all crystal grains of this wafer (step 50).
The present invention and existing wafer test apparatus are compared, because at wafer test apparatus 100 is to increase by an immediate access module 130, test data in order to instant each crystal grain of storage, therefore when test action hinders interruption for some reason, the test data of before having finished can be stored in the immediate access module 130.Thus, after fault is got rid of, control module 122 will can read previous stored test data (step 60), and according to parameters such as wafer lot number, wafer sequence number and technique initializations that host computer system provided (as the testing sequence of crystal grain, board set point etc.), corresponding generation one automatically replies data (step 70), use and make wafer testing system 100 be returned to the state before test is interrupted, and control on the crystal grain of the wafer of just testing when tester table 124 is got back to system break, continue uncompleted test action.
Certainly,, then wafer can be moved in another tester table,, on the crystal grain of the wafer of just testing when the control tester table is got back to system break, continue uncompleted test action again according to the above-mentioned data that automatically reply if fault can't be got rid of at short notice.
What deserves to be mentioned is that the described immediate access module of the above embodiment of the present invention be except that being independent of separately the test macro, also can in be built in the test macro.In addition, more can be by the rewriting of program, make database simultaneously as an immediate access module, and instant store test data is provided when carrying out wafer sort, can automatically reply the function of test data with having no progeny in the test.
In conjunction with the wafer test apparatus of the foregoing description, the related procedure that tool of the present invention automatically replies the chip detecting method of function is described as follows.Please refer to Fig. 2, it illustrates the schematic flow sheet that tool of the present invention automatically replies the chip detecting method of function.
At first, for example carry out one first testing procedure (step 202) by one first tester table, wherein, operating personnel batch move to a wafer on the wafer test apparatus earlier, and the host computer system of testing apparatus reads related datas such as wafer lot number, technological parameter simultaneously, and carry out the calibration of wafer position, and the mobile test device is to actions such as initial positions.Then,, in regular turn a plurality of crystal grain on the wafer are tested, and stored the test data of each crystal grain by an instant storage module immediately by first tester table.
Then, shown in step 204,, then can finish the test of the crystal grain on each wafer in regular turn, and finish the action (step 214) of test if test process is smooth.And if test action when interrupting (step 204) unusually, then carry out one and automatically reply data and produce step (step 206), to automatically reply data according to the stored test data generation one of storage module immediately.
Automatically reply after data produce steps (step 206) finishing, can select that first tester table is carried out a fault and get rid of step (step 208), or carry out a transfer step (step 210) and wafer is sent to one second tester table from the first original tester table.Wherein,, then after fault is got rid of, carry out one second testing procedure (step 212), begin to continue test according to automatically replying data from the crystal grain of not finishing test as yet by the first original tester table by first tester table if select carry out step 208.If select carry out step 210, then carry out second testing procedure (step 212) by second tester table, begin to continue test according to automatically replying data from the crystal grain of not finishing test as yet.
At last, shown in step 214, finish the test of wafer.
By on the other hand, tool of the present invention automatically replies the wafer test apparatus and the chip detecting method of function, can be after wafer be written into, judge whether to carry out automatically replying function, this will decide on the related data that automatically replies existing wafer that data and host computer system read batch in the test macro in advance.Wherein, do not automatically reply function if need not carry out, then the crystal grain by initial position begins to test, and finishes the test of same batch all wafers.In addition, if need to carry out and automatically reply function, then with wafer data that host computer system read with automatically reply data and compare, the residing crystal grain of tester table position when last time testing interruption to find out, and successively the crystal grain of not finishing test is continued test by the test interruptions, and finish the test action of all wafers.
It should be noted that, wafer test apparatus and chip detecting method that tool of the present invention automatically replies function remove the wafer pin survey that can be applicable in the above-mentioned semiconductor technology, outside for example pretest (Pre-test), back test (Post-test) and the sampling and testing (Sampling-test), for example more can be applicable on laser preparing or the product final test.With regard to the wafer pin was surveyed, tester table was a pin and surveys machine, when testing, was that mobile in regular turn pin is surveyed the position of machine to each crystal grain, with the relevant resistance of the joint sheet on the measurement crystal grain with circuit.In addition, when being applied to laser preparing, tester table for example is a laser repairing, and it is the result according to previous testing electrical property, and bad crystal grain is carried out redundant action of repairing.Yet no matter for the former or the latter, tool of the present invention automatically replies the wafer test apparatus and the chip detecting method of function, can interrupt and cause problem such as data loss that effective solution is provided at its test.
In sum, automatically reply the wafer test apparatus and the chip detecting method of function, the tester table situation of (Reset) of resetting in the time of can avoiding testing aborted by tool of the present invention.When test, but the test data of each crystal grain of immediate access module instant recording in the wafer test apparatus, and corresponding output one automatically replies data in system break and will operate again the time, so that testing apparatus is returned to the state before test is interrupted, and tester table also can be returned on the position of crystal grain of previous interrupt test, and continues to finish the action of test.Tool of the present invention automatically replies the wafer test apparatus of function and chip detecting method and can save because of test and interrupt, and the time that causes starting anew to test required waste, and can avoid crystal grain because of repeating to estimate the problem that wrecks, and then enhances productivity.
Though the present invention discloses as above with a preferred embodiment; right its is not in order to limiting the present invention, anyly has the knack of this skill person, without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking the accompanying Claim person of defining.
Claims (11)
1. a tool automatically replies the chip detecting method of function, comprising:
One first testing procedure is tested a plurality of crystal grain on the wafer in regular turn, and stores the test data of each described crystal grain immediately;
One automatically replies data produces step, when this first testing procedure interrupts because of a fault, promptly produces one according to the test data that has stored and automatically replies data; And
One second testing procedure automatically replies data according to this, begins to continue test from the crystal grain of not finishing test as yet.
2. tool as claimed in claim 1 automatically replies the chip detecting method of function, wherein, in this first testing procedure, those crystal grain tested by one first tester table, and the test data of corresponding each described crystal grain of output.
3. tool as claimed in claim 1 automatically replies the chip detecting method of function, wherein, in this first testing procedure, stores the test data of each described crystal grain immediately by an immediate access module.
4. tool as claimed in claim 1 automatically replies the chip detecting method of function, wherein, this automatically reply data produce step after and before this second testing procedure, more comprise fault eliminating step, make this first tester table can normal running.
5. tool as claimed in claim 4 automatically replies the chip detecting method of function, wherein, in this second testing procedure, utilizes this first tester table to automatically reply data according to this and begins to continue test from the crystal grain of not finishing test as yet.
6. tool as claimed in claim 1 automatically replies the chip detecting method of function, wherein, this automatically replies after the data generation step and before this second testing procedure, more comprises a transfer step, and this wafer is sent to one second tester table from this first tester table.
7. tool as claimed in claim 6 automatically replies the chip detecting method of function, wherein, in this second testing procedure, utilizes this second tester table to automatically reply data according to this and begins to continue test from the crystal grain of not finishing test as yet.
8. a tool automatically replies the wafer test apparatus of function, is suitable for a plurality of crystal grain on the wafer are tested, and this device comprises:
One host computer system is in order to the flow process of keyholed back plate integrated testability;
One test macro is electrically connected to this host computer system, in regular turn those crystal grain tested in order to the order that receives this host computer system, and a plurality of test datas of corresponding output; And
One immediate access module, be electrically connected to this test macro, in order to those test datas of instant recording, when testing because of aborted, this test macro is to produce one according to those stored test datas of this immediate access module to automatically reply data, and automatically replies data to not finishing the crystal grain continuation test of test as yet according to this.
9. tool as claimed in claim 8 automatically replies the wafer test apparatus of function, and wherein, this test macro comprises:
One tester table; And
One control module, be electrically connected to this host computer system, this immediate access module and this tester table, wherein this control module is that the order that receives this host computer system is tested to control this tester table, and corresponding those test datas of output are to this immediate access module, and when testing because of aborted, this control module more produces this according to those stored test datas of this immediate access module and automatically replies data, uses this tester table of control and continues uncompleted test.
10. tool as claimed in claim 9 automatically replies the wafer test apparatus of function, and wherein, this tester table comprises pin survey machine.
11. tool as claimed in claim 9 automatically replies the wafer test apparatus of function, wherein, this tester table comprises laser repairing.
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| CNB200410089642XA CN100372094C (en) | 2004-10-29 | 2004-10-29 | Wafer testing device with automatic recovery function and wafer testing method |
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| CNB200410089642XA CN100372094C (en) | 2004-10-29 | 2004-10-29 | Wafer testing device with automatic recovery function and wafer testing method |
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| CN1767164A CN1767164A (en) | 2006-05-03 |
| CN100372094C true CN100372094C (en) | 2008-02-27 |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102053217A (en) * | 2009-11-05 | 2011-05-11 | 上海华虹Nec电子有限公司 | Method for quickly processing wafer after sort interruption under working condition |
| CN102956517B (en) * | 2011-08-22 | 2016-03-30 | 北京中科信电子装备有限公司 | A kind of method of transmission fatigue of wafer test |
| CN104422864B (en) * | 2013-08-21 | 2017-10-24 | 上海华虹宏力半导体制造有限公司 | The confirmation method of position alignment is realized in wafer sort |
| CN107544010B (en) * | 2016-06-28 | 2020-05-01 | 中芯国际集成电路制造(上海)有限公司 | Test equipment and test method |
| CN107167675A (en) * | 2017-03-28 | 2017-09-15 | 深圳市微科信息技术有限公司 | A kind of ageing testing method and device of CANBus terminals |
| CN108241119A (en) * | 2017-11-10 | 2018-07-03 | 精华电子(苏州)有限公司 | Leak electricity current test system and method |
| CN109390246A (en) * | 2018-10-24 | 2019-02-26 | 上海华力微电子有限公司 | A kind of WAT test method and system |
| CN113866530A (en) * | 2021-08-17 | 2021-12-31 | 广西电网有限责任公司防城港供电局 | Automatic test generation test report system of recognition tester |
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| US20020095624A1 (en) * | 2000-12-04 | 2002-07-18 | International Business Machines Corporation | Method for testing a computer bus using a bridge chip having a freeze-on-error option |
| US6498999B1 (en) * | 2000-07-24 | 2002-12-24 | Lsi Logic Corporation | Method and apparatus for design verification of an integrated circuit using a simulation test bench environment |
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| CN1234562A (en) * | 1998-05-04 | 1999-11-10 | 国际商业机器公司 | Enhanced error handling for I/O load/store operations to-PCI devices |
| CN1312922A (en) * | 1998-08-11 | 2001-09-12 | 艾利森电话股份有限公司 | Fault tolerant computer system |
| US6498999B1 (en) * | 2000-07-24 | 2002-12-24 | Lsi Logic Corporation | Method and apparatus for design verification of an integrated circuit using a simulation test bench environment |
| US20020095624A1 (en) * | 2000-12-04 | 2002-07-18 | International Business Machines Corporation | Method for testing a computer bus using a bridge chip having a freeze-on-error option |
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