KR101031226B1 - Heater Block of Rapid Heat Treatment Device - Google Patents
Heater Block of Rapid Heat Treatment Device Download PDFInfo
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- KR101031226B1 KR101031226B1 KR1020090077425A KR20090077425A KR101031226B1 KR 101031226 B1 KR101031226 B1 KR 101031226B1 KR 1020090077425 A KR1020090077425 A KR 1020090077425A KR 20090077425 A KR20090077425 A KR 20090077425A KR 101031226 B1 KR101031226 B1 KR 101031226B1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
- H05B3/744—Lamps as heat source, i.e. heating elements with protective gas envelope, e.g. halogen lamps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
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Abstract
본 발명은 급속열처리 장치의 히터블록에 관한 것으로서, 구체적으로, 가열램프가 쪽매맞춤 방식으로 치밀하게 배열되는 것을 특징으로 한다. 상기 쪽매맞춤 방식은 가열램프 복수개가 직교 형태로 곧게 라인으로 뻗어나가도록 설치되고 이러한 직교 라인 복수개가 이웃한 것끼리 합치되도록 반복 배열되는 구조를 가질 수 있다. 본 발명에 의하면, 종래에 비하여 램프의 빈 공간(void)에 의한 온도구배를 방지할 수 있을 뿐만 아니라, 가열램프가 치밀하게 배열되기 때문에 열복사 면적에 대한 열 밀도가 증가하여 적은 에너지로 동일한 열처리 효율을 얻을 수 있다. 그리고 섹터할당 온도제어 개념을 도입할 때도 종래에 비하여 독립적으로 제어해야 할 섹터의 면적을 크게 해도 충분히 균일한 온도제어가 가능하기 때문에 온도제어회로가 간단해진다. The present invention relates to a heater block of the rapid heat treatment apparatus, and in particular, the heating lamp is characterized in that the densely arranged in a pacing manner. The page matching method may have a structure in which a plurality of heating lamps are installed to extend in a straight line in an orthogonal form, and the plurality of orthogonal lines are repeatedly arranged so as to coincide with neighboring ones. According to the present invention, not only can the temperature gradient caused by the void of the lamp be prevented, but also the heating lamps are densely arranged, so that the heat density of the heat radiation area is increased, so that the same heat treatment efficiency is achieved with less energy. Can be obtained. In addition, even when the concept of sector allocation temperature control is introduced, the temperature control circuit is simplified because a sufficiently uniform temperature control is possible even if the area of the sector to be controlled independently is increased as compared with the conventional art.
급속열처리, 히터블록, 쪽매맞춤, T형, 가열램프, 온도구배 Rapid Heat Treatment, Heater Block, Matching, T Type, Heating Lamp, Temperature Gradient
Description
본 발명은 급속열처리장치의 히터블록에 관한 것으로서, 가열램프가 쪽매맞춤 방식으로 배열되는 히터블록에 관한 것이다. The present invention relates to a heater block of a rapid heat treatment apparatus, and more particularly, to a heater block in which heating lamps are arranged in a paging manner.
급속열처리 장치는 가열램프의 적외선을 통하여 기판을 빠른 속도로 가열하여 공정을 진행하는 것이다. 이 때 기판이 골고루 가열되도록 하기 위하여 기판을 수평 회전시키는 등 다양한 방법이 시도되고 있다. 그러나 가열램프의 배열구조에 기인한 문제 때문에 기판이 전체적으로 골고루 가열되지 못하고 미세한 온도구배가 생기는 문제가 발생하고 있다. 이는 기판에 형성되는 소자의 집적화가 증가할수록 소자의 신뢰도 및 생산수율에 바람직하지 않게 작용한다. The rapid heat treatment apparatus is a process of heating a substrate at a high speed through infrared rays of a heating lamp. At this time, various methods have been attempted such as horizontally rotating the substrate so that the substrate is evenly heated. However, due to a problem due to the arrangement of the heating lamp, the substrate is not heated evenly as a whole, and there is a problem of generating a fine temperature gradient. This undesirably affects the reliability and production yield of devices as the integration of devices formed on the substrate increases.
도 1은 종래의 동심원적 가열램프 배열을 설명하기 위한 도면으로서, 히터블록(10)을 밑에서 위쪽으로, 즉 가열대상물인 기판 등과 대면하는 대향면에서 바라본 것이다. 도 1을 참조하면, 히터블록(10)에 복수 개의 가열램프(20)가 설치, 배 열되어 있음을 알 수 있다. 도 2는 도 1의 가열램프(20)가 T형-가열램프(28)일 경우, 이를 설명하기 위한 도면이다. 구분을 위하여 일반적인 가열램프와 T형-가열램프에 대해서 서로 다른 참조번호를 사용하였다. 도 2에 도시된 바와 같이, T형 가열램프(28)는 옆에서 보면 T자형이지만 밑에서 보면 일자 막대모양을 하고 있다. 옆에서 볼 때 위로 돌출된 부분이 히터블록(10)에 꼽혀져서 히터블록에 설치되게 된다. 따라서 도 1에 도시된 바와 같은 히터블록(10)에 T형-가열램프(28)가 꼽힌 후, 히터블록(10)을 밑에서 위로 바라보면 T형-가열램프(28)는 일자 막대모양을 한다. 종래에는 이러한 T형-가열램프(28)가 동심원적 배열을 하도록 히터블록(10)에 설치되었다. 1 is a view for explaining a conventional concentric heating lamp arrangement, it is viewed from the opposite surface facing the
그러나 이러한 동심원적 배열을 할 때에는 일점쇄선으로 표시한 바와 같이 직선(21) 및 동심원(22) 형태의 빈 공간이 발생하게 되어 기판(미도시)이 회전하더라도 열중첩구간의 발생과 이러한 열중첩구간 사이의 틈(void)의 존재로 인하여 기판이 전체적으로 균일하게 가열되지 못하여 미세한 온도 구배가 발생하게 된다. However, in such concentric arrangement, as shown by the dashed-dotted line, empty spaces in the form of
도 3은 종래의 다른 형태의 동심원적 가열램프 배열을 설명하기 위한 도면이다. 도 3의 경우에도 직선(21) 및 동심원(22) 형태의 빈 공간이 생기는 것을 피할 수는 없다. 3 is a view for explaining a conventional concentric heating lamp arrangement of another type. In the case of FIG. 3, it is inevitable that empty spaces in the form of
상술한 바와 같이 종래의 동심원적 가열램프 배열은 램프 배열의 특성상 기판을 수평 회전시키더라도 기판의 온도구배를 피할 수가 없으며, 이러한 온도구배를 없애기 위해서는 히터블록을 섹터로 구분하여 가열램프에 인가되는 전력량을 섹터별로 조절하는 섹터할당 온도제어 개념을 도입해야 하는 등 복잡한 문제가 발생 하게 된다. As described above, in the conventional concentric heating lamp array, the temperature gradient of the substrate cannot be avoided even if the substrate is horizontally rotated due to the characteristics of the lamp array, and in order to eliminate the temperature gradient, the amount of power applied to the heating lamp by dividing the heater block into sectors. Complex problems arise, such as the introduction of the concept of sector allocation temperature control that adjusts sector by sector.
따라서 본 발명이 해결하고자 하는 과제는, 가열램프를 종래의 동심원적으로 배열하는 것에서 탈피하여 새로운 형태로 빈틈없이 배열함으로써 램프 배열에 의하여 발생하는 온도구배를 방지할 수 있는 급속열처리장치의 히터블록을 제공하는 데 있다.Therefore, the problem to be solved by the present invention is a heater block of a rapid heat treatment apparatus that can avoid the temperature gradient caused by the lamp arrangement by arranging the heating lamps in a new form without the conventional concentric arrangement of the heating lamp. To provide.
상기 과제를 달성하기 위한 본 발명에 따른 히터블록은, 가열 대상물을 급속하게 가열하여 공정을 처리하기 위한 가열램프가 복수 개 설치되는 급속열처리 장치에 사용되는 것으로서, 상기 가열 대상물을 대면하는 복수 개의 상기 가열램프들의 대향면이, 상기 가열램프들이 쪽매맞춤 방식으로 치밀하게 배열됨으로써, 틈을 가지지 않는 것을 특징으로 한다.The heater block according to the present invention for achieving the above object is used in a rapid heat treatment apparatus is provided with a plurality of heating lamps for rapidly heating the heating object to process the process, a plurality of the above facing the heating object Opposite surfaces of the heating lamps are characterized in that the heating lamps are arranged closely in a paging manner so that they do not have a gap.
여기서, 상기 가열램프들의 대향면에서 상기 가열램프들의 각각이 일자 막대모양을 가지는 것이 바람직하다.Here, it is preferable that each of the heating lamps has a straight bar shape at the opposite surface of the heating lamps.
또한, 상기 가열램프가 상기 가열 대상물의 반대쪽으로 돌출부분을 가지는 T형-가열램프이어도 좋다.Further, the heating lamp may be a T-heating lamp having a protruding portion opposite to the heating object.
본 발명에서, 상기 쪽매맞춤 방식은 상기 가열램프 복수개가 직교 형태로 곧 게 라인으로 뻗어나가도록 설치되고 상기 라인 복수개가 이웃한 것끼리 합치되도록 반복 배열되도록 할 수 있는데, 이 경우, 앞에 있는 가열램프의 후단의 끝면에 뒤에 있는 가열램프의 선단의 측면이 인접하도록 설치되게 하여도 좋고, 앞에 있는 가열램프의 후단의 측면에 뒤에 있는 가열램프의 선단의 끝면이 인접하도록 설치되게 하여도 좋다.In the present invention, the side-fitting method may be installed so that the plurality of heating lamps extend in a straight line in an orthogonal form and the plurality of lines are repeatedly arranged so as to coincide with the neighboring ones, in this case, the front of the heating lamp The end surface of the rear heating lamp may be provided adjacent to the end surface of the rear end, or the end surface of the rear heating lamp may be adjacent to the rear side of the rear heating lamp.
본 발명에 의하면, 종래에 비하여 램프의 빈공간(void)에 의한 온도구배를 방지할 수 있을 뿐만 아니라, 가열램프가 치밀하게 배열되기 때문에 열복사 면적에 대한 열 밀도가 증가하여 적은 에너지로 동일한 열처리 효율을 얻을 수 있다. 그리고 섹터할당 온도제어 개념을 도입할 때도 종래에 비하여 독립적으로 제어해야 할 섹터의 면적을 크게 해도 충분히 균일한 온도제어가 가능하기 때문에 온도제어회로가 간단해 진다. According to the present invention, not only can the temperature gradient due to the void of the lamp be prevented, but also the heating lamps are densely arranged, so that the heat density of the heat radiation area is increased, so that the same heat treatment efficiency is achieved with less energy. Can be obtained. In addition, even when the concept of sector allocation temperature control is introduced, the temperature control circuit is simplified since the temperature control circuit can be sufficiently uniform even if the area of the sector to be controlled independently is increased.
이하에서, 본 발명의 바람직한 실시예를 첨부한 도면들을 참조하여 상세히 설명한다. 아래의 실시예는 본 발명의 내용을 이해하기 위해 제시된 것일 뿐이며 당 분야에서 통상의 지식을 가진 자라면 본 발명의 기술적 사상 내에서 많은 변형이 가능할 것이다. 따라서 본 발명의 권리범위가 이러한 실시예에 한정되는 것으로 해석돼서는 안 된다. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following examples are only presented to understand the content of the present invention, and those skilled in the art will be capable of many modifications within the technical spirit of the present invention. Therefore, the scope of the present invention should not be construed as being limited to these embodiments.
도 4 및 도 5는 본 발명에 따른 쪽매맞춤형 가열램프 배열을 설명하기 위한 도면들이다. 본 발명은 종래의 동심원 형태의 가열램프 배열을 탈피하여 쪽매맞춤 방식으로 히터블록(10)의 밑면이 빈틈없이 채워지는 것을 특징으로 한다. 4 and 5 are views for explaining a side-mounted heating lamp arrangement according to the present invention. The present invention is characterized in that the bottom surface of the
쪽매맞춤은 평면도형을 겹치지 않으면서 빈틈없이 모으는 것을 말하는데, 본 발명에서는 저면에서 볼 때에, 가열대상물인 기판 등에서 볼 때에 일자 막대모양을 갖는 가열램프(20)를 사용하기 때문에 직사각형을 겹치지 않게 빈틈없이 히터블록(10)의 밑면에 설치하는 것을 말한다. 물론 이러한 쪽매맞춤을 이루기 위해서, 저면에서 본 가열램프의 구조가 반드시 일자 막대모양을 가질 필요는 없지만, 배열의 편의상 본 실시예에서는 일자 막대모양인 것을 선택하였으며, 이러한 구조에는 도 2에서 설명하였던 T-형 가열램프를 사용하는 것이 바람직하다.The page matching refers to collecting the tops without overlapping the planar shapes. In the present invention, when using the
가열램프(20)는 밑에서 볼 때 직사각형 형태를 하여 두 개의 단(S, F)을 가진다. 본 발명에서 말하는 쪽매맞춤이란 도 5에 도시된 바와 같이 이러한 가열램프(20)가 직교 형태로 곧게 라인으로 뻗어나가도록 설치되며 이러한 직교 라인(25)이 이웃한 것끼리 합치되도록 반복 배열되는 것을 말한다.The
도 5a는 앞에 있는 가열램프의 후단(F)의 끝면에 뒤에 있는 가열램프의 선단(S)의 측면이 인접하도록 하면서 직교 라인(25)이 형성되는 것을 보여주는 것이고, 도 5b는 앞에 있는 가열램프의 후단(F)의 측면에 뒤에 있는 가열램프의 선단(S)의 끝면이 인접하도록 하면서 직교형 라인이 형성되는 것을 보여주는 것이다.Fig. 5a shows an
도 4는 직교형 라인이 수직으로 배열되는 것을 보여주는 것이고, 도 6은 직교형 라인이 사선으로 배열되는 것을 보여주는 것이다. 4 shows the orthogonal lines arranged vertically, and FIG. 6 shows the orthogonal lines arranged diagonally.
도 4 및 도 6에 도시된 바와 같이 직사각형을 쪽매맞춤 방식으로 배열하면 히터블록(10)의 밑면을 가열램프(20)로 빈 공간 없이 채울 수 있게 된다.As shown in Figure 4 and 6 arranged in a pager alignment way it is possible to fill the bottom surface of the
상기한 바와 같이, 본 발명에 의하면 종래에 비하여 램프의 빈공간(void)에 의한 기판(30)의 온도구배를 방지할 수 있을 뿐만 아니라, 가열램프(20)가 치밀하게 배열되기 때문에 열복사 면적에 대한 열 밀도가 증가하여 적은 에너지로 동일한 열처리 효율을 얻을 수 있다. 그리고 섹터할당 온도제어 개념을 도입할 때도 종래에 비하여 독립적으로 제어해야 할 섹터의 면적을 크게 해도 충분히 균일한 온도제어가 가능하기 때문에 온도제어회로가 간단해 진다. As described above, according to the present invention, not only can the temperature gradient of the
도 1은 종래의 동심원적 가열램프 배열을 설명하기 위한 도면;1 is a view for explaining a conventional concentric heating lamp arrangement;
도 2는 도 1의 T형-가열램프(20)를 설명하기 위한 도면;2 is a view for explaining the T-
도 3은 종래의 다른 형태의 동심원적 가열램프 배열을 설명하기 위한 도면;Figure 3 is a view for explaining another conventional concentric heating lamp arrangement of the form;
도 4 및 도 5는 본 발명의 일예에 따른 쪽매맞춤형 가열램프 배열을 설명하기 위한 도면들;4 and 5 are views for explaining a side-mounted heating lamp arrangement according to an embodiment of the present invention;
도 6은 본 발명의 다른 예에 따른 쪽매맞춤형 가열램프 배열을 설명하기 위한 도면이다. 6 is a view for explaining a side-mounted heating lamp arrangement according to another embodiment of the present invention.
<도면의 주요부분에 대한 참조번호의 설명><Description of reference numbers for the main parts of the drawings>
10: 히터블록 20: 가열램프10: heater block 20: heating lamp
21, 22: 공간(void) 25: 직교 라인21, 22: void 25: orthogonal line
28: T형 가열램프28: T-type heating lamp
Claims (6)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020090077425A KR101031226B1 (en) | 2009-08-21 | 2009-08-21 | Heater Block of Rapid Heat Treatment Device |
| PCT/KR2010/005119 WO2011021796A2 (en) | 2009-08-21 | 2010-08-04 | Heater block for a rapid thermal processing apparatus |
| CN201080040511.6A CN102484896B (en) | 2009-08-21 | 2010-08-04 | Heating components of rapid thermal processing equipment |
| US13/391,410 US8913884B2 (en) | 2009-08-21 | 2010-08-04 | Heater block for a rapid thermal processing apparatus |
| TW099127401A TWI445435B (en) | 2009-08-21 | 2010-08-17 | Heater block of rapid thermal processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020090077425A KR101031226B1 (en) | 2009-08-21 | 2009-08-21 | Heater Block of Rapid Heat Treatment Device |
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| Publication Number | Publication Date |
|---|---|
| KR20110019840A KR20110019840A (en) | 2011-03-02 |
| KR101031226B1 true KR101031226B1 (en) | 2011-04-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR1020090077425A Active KR101031226B1 (en) | 2009-08-21 | 2009-08-21 | Heater Block of Rapid Heat Treatment Device |
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| Country | Link |
|---|---|
| US (1) | US8913884B2 (en) |
| KR (1) | KR101031226B1 (en) |
| CN (1) | CN102484896B (en) |
| TW (1) | TWI445435B (en) |
| WO (1) | WO2011021796A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9431279B2 (en) | 2012-05-18 | 2016-08-30 | Ap Systems Inc. | Heater block and a substrate treatment apparatus |
Families Citing this family (399)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10378106B2 (en) | 2008-11-14 | 2019-08-13 | Asm Ip Holding B.V. | Method of forming insulation film by modified PEALD |
| US9394608B2 (en) | 2009-04-06 | 2016-07-19 | Asm America, Inc. | Semiconductor processing reactor and components thereof |
| US8802201B2 (en) | 2009-08-14 | 2014-08-12 | Asm America, Inc. | Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species |
| US9312155B2 (en) | 2011-06-06 | 2016-04-12 | Asm Japan K.K. | High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules |
| US9793148B2 (en) | 2011-06-22 | 2017-10-17 | Asm Japan K.K. | Method for positioning wafers in multiple wafer transport |
| US10364496B2 (en) | 2011-06-27 | 2019-07-30 | Asm Ip Holding B.V. | Dual section module having shared and unshared mass flow controllers |
| US10854498B2 (en) | 2011-07-15 | 2020-12-01 | Asm Ip Holding B.V. | Wafer-supporting device and method for producing same |
| US20130023129A1 (en) | 2011-07-20 | 2013-01-24 | Asm America, Inc. | Pressure transmitter for a semiconductor processing environment |
| US9017481B1 (en) | 2011-10-28 | 2015-04-28 | Asm America, Inc. | Process feed management for semiconductor substrate processing |
| US8946830B2 (en) | 2012-04-04 | 2015-02-03 | Asm Ip Holdings B.V. | Metal oxide protective layer for a semiconductor device |
| US9558931B2 (en) | 2012-07-27 | 2017-01-31 | Asm Ip Holding B.V. | System and method for gas-phase sulfur passivation of a semiconductor surface |
| US9659799B2 (en) | 2012-08-28 | 2017-05-23 | Asm Ip Holding B.V. | Systems and methods for dynamic semiconductor process scheduling |
| US9021985B2 (en) | 2012-09-12 | 2015-05-05 | Asm Ip Holdings B.V. | Process gas management for an inductively-coupled plasma deposition reactor |
| US9324811B2 (en) | 2012-09-26 | 2016-04-26 | Asm Ip Holding B.V. | Structures and devices including a tensile-stressed silicon arsenic layer and methods of forming same |
| US10714315B2 (en) | 2012-10-12 | 2020-07-14 | Asm Ip Holdings B.V. | Semiconductor reaction chamber showerhead |
| US9640416B2 (en) | 2012-12-26 | 2017-05-02 | Asm Ip Holding B.V. | Single-and dual-chamber module-attachable wafer-handling chamber |
| US20160376700A1 (en) | 2013-02-01 | 2016-12-29 | Asm Ip Holding B.V. | System for treatment of deposition reactor |
| US9484191B2 (en) | 2013-03-08 | 2016-11-01 | Asm Ip Holding B.V. | Pulsed remote plasma method and system |
| US9589770B2 (en) | 2013-03-08 | 2017-03-07 | Asm Ip Holding B.V. | Method and systems for in-situ formation of intermediate reactive species |
| US8993054B2 (en) | 2013-07-12 | 2015-03-31 | Asm Ip Holding B.V. | Method and system to reduce outgassing in a reaction chamber |
| US9018111B2 (en) | 2013-07-22 | 2015-04-28 | Asm Ip Holding B.V. | Semiconductor reaction chamber with plasma capabilities |
| US9793115B2 (en) | 2013-08-14 | 2017-10-17 | Asm Ip Holding B.V. | Structures and devices including germanium-tin films and methods of forming same |
| US9240412B2 (en) | 2013-09-27 | 2016-01-19 | Asm Ip Holding B.V. | Semiconductor structure and device and methods of forming same using selective epitaxial process |
| US9556516B2 (en) | 2013-10-09 | 2017-01-31 | ASM IP Holding B.V | Method for forming Ti-containing film by PEALD using TDMAT or TDEAT |
| US10179947B2 (en) | 2013-11-26 | 2019-01-15 | Asm Ip Holding B.V. | Method for forming conformal nitrided, oxidized, or carbonized dielectric film by atomic layer deposition |
| USD725168S1 (en) * | 2014-02-04 | 2015-03-24 | Asm Ip Holding B.V. | Heater block |
| USD726884S1 (en) * | 2014-02-04 | 2015-04-14 | Asm Ip Holding B.V. | Heater block |
| US10683571B2 (en) | 2014-02-25 | 2020-06-16 | Asm Ip Holding B.V. | Gas supply manifold and method of supplying gases to chamber using same |
| US9447498B2 (en) | 2014-03-18 | 2016-09-20 | Asm Ip Holding B.V. | Method for performing uniform processing in gas system-sharing multiple reaction chambers |
| US10167557B2 (en) | 2014-03-18 | 2019-01-01 | Asm Ip Holding B.V. | Gas distribution system, reactor including the system, and methods of using the same |
| US11015245B2 (en) | 2014-03-19 | 2021-05-25 | Asm Ip Holding B.V. | Gas-phase reactor and system having exhaust plenum and components thereof |
| US9404587B2 (en) | 2014-04-24 | 2016-08-02 | ASM IP Holding B.V | Lockout tagout for semiconductor vacuum valve |
| US10858737B2 (en) | 2014-07-28 | 2020-12-08 | Asm Ip Holding B.V. | Showerhead assembly and components thereof |
| US9543180B2 (en) | 2014-08-01 | 2017-01-10 | Asm Ip Holding B.V. | Apparatus and method for transporting wafers between wafer carrier and process tool under vacuum |
| US9890456B2 (en) | 2014-08-21 | 2018-02-13 | Asm Ip Holding B.V. | Method and system for in situ formation of gas-phase compounds |
| US10941490B2 (en) | 2014-10-07 | 2021-03-09 | Asm Ip Holding B.V. | Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same |
| US9657845B2 (en) | 2014-10-07 | 2017-05-23 | Asm Ip Holding B.V. | Variable conductance gas distribution apparatus and method |
| KR102300403B1 (en) | 2014-11-19 | 2021-09-09 | 에이에스엠 아이피 홀딩 비.브이. | Method of depositing thin film |
| KR102263121B1 (en) | 2014-12-22 | 2021-06-09 | 에이에스엠 아이피 홀딩 비.브이. | Semiconductor device and manufacuring method thereof |
| WO2016122835A1 (en) * | 2015-01-30 | 2016-08-04 | Applied Materials, Inc. | Lamp heating for process chamber |
| US9478415B2 (en) | 2015-02-13 | 2016-10-25 | Asm Ip Holding B.V. | Method for forming film having low resistance and shallow junction depth |
| US10529542B2 (en) | 2015-03-11 | 2020-01-07 | Asm Ip Holdings B.V. | Cross-flow reactor and method |
| US10276355B2 (en) | 2015-03-12 | 2019-04-30 | Asm Ip Holding B.V. | Multi-zone reactor, system including the reactor, and method of using the same |
| US10458018B2 (en) | 2015-06-26 | 2019-10-29 | Asm Ip Holding B.V. | Structures including metal carbide material, devices including the structures, and methods of forming same |
| US10600673B2 (en) | 2015-07-07 | 2020-03-24 | Asm Ip Holding B.V. | Magnetic susceptor to baseplate seal |
| US9899291B2 (en) | 2015-07-13 | 2018-02-20 | Asm Ip Holding B.V. | Method for protecting layer by forming hydrocarbon-based extremely thin film |
| US10043661B2 (en) | 2015-07-13 | 2018-08-07 | Asm Ip Holding B.V. | Method for protecting layer by forming hydrocarbon-based extremely thin film |
| US10083836B2 (en) | 2015-07-24 | 2018-09-25 | Asm Ip Holding B.V. | Formation of boron-doped titanium metal films with high work function |
| US10087525B2 (en) | 2015-08-04 | 2018-10-02 | Asm Ip Holding B.V. | Variable gap hard stop design |
| US9647114B2 (en) | 2015-08-14 | 2017-05-09 | Asm Ip Holding B.V. | Methods of forming highly p-type doped germanium tin films and structures and devices including the films |
| US9711345B2 (en) | 2015-08-25 | 2017-07-18 | Asm Ip Holding B.V. | Method for forming aluminum nitride-based film by PEALD |
| US9960072B2 (en) | 2015-09-29 | 2018-05-01 | Asm Ip Holding B.V. | Variable adjustment for precise matching of multiple chamber cavity housings |
| US9909214B2 (en) | 2015-10-15 | 2018-03-06 | Asm Ip Holding B.V. | Method for depositing dielectric film in trenches by PEALD |
| US10211308B2 (en) | 2015-10-21 | 2019-02-19 | Asm Ip Holding B.V. | NbMC layers |
| US10322384B2 (en) | 2015-11-09 | 2019-06-18 | Asm Ip Holding B.V. | Counter flow mixer for process chamber |
| US9455138B1 (en) | 2015-11-10 | 2016-09-27 | Asm Ip Holding B.V. | Method for forming dielectric film in trenches by PEALD using H-containing gas |
| US9905420B2 (en) | 2015-12-01 | 2018-02-27 | Asm Ip Holding B.V. | Methods of forming silicon germanium tin films and structures and devices including the films |
| US9607837B1 (en) | 2015-12-21 | 2017-03-28 | Asm Ip Holding B.V. | Method for forming silicon oxide cap layer for solid state diffusion process |
| US9627221B1 (en) | 2015-12-28 | 2017-04-18 | Asm Ip Holding B.V. | Continuous process incorporating atomic layer etching |
| US9735024B2 (en) | 2015-12-28 | 2017-08-15 | Asm Ip Holding B.V. | Method of atomic layer etching using functional group-containing fluorocarbon |
| US11139308B2 (en) | 2015-12-29 | 2021-10-05 | Asm Ip Holding B.V. | Atomic layer deposition of III-V compounds to form V-NAND devices |
| US10468251B2 (en) | 2016-02-19 | 2019-11-05 | Asm Ip Holding B.V. | Method for forming spacers using silicon nitride film for spacer-defined multiple patterning |
| US9754779B1 (en) | 2016-02-19 | 2017-09-05 | Asm Ip Holding B.V. | Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches |
| US10529554B2 (en) | 2016-02-19 | 2020-01-07 | Asm Ip Holding B.V. | Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches |
| US10501866B2 (en) | 2016-03-09 | 2019-12-10 | Asm Ip Holding B.V. | Gas distribution apparatus for improved film uniformity in an epitaxial system |
| US10343920B2 (en) | 2016-03-18 | 2019-07-09 | Asm Ip Holding B.V. | Aligned carbon nanotubes |
| US9892913B2 (en) | 2016-03-24 | 2018-02-13 | Asm Ip Holding B.V. | Radial and thickness control via biased multi-port injection settings |
| US10865475B2 (en) | 2016-04-21 | 2020-12-15 | Asm Ip Holding B.V. | Deposition of metal borides and silicides |
| US10087522B2 (en) | 2016-04-21 | 2018-10-02 | Asm Ip Holding B.V. | Deposition of metal borides |
| US10190213B2 (en) | 2016-04-21 | 2019-01-29 | Asm Ip Holding B.V. | Deposition of metal borides |
| US10032628B2 (en) | 2016-05-02 | 2018-07-24 | Asm Ip Holding B.V. | Source/drain performance through conformal solid state doping |
| US10367080B2 (en) | 2016-05-02 | 2019-07-30 | Asm Ip Holding B.V. | Method of forming a germanium oxynitride film |
| KR102592471B1 (en) | 2016-05-17 | 2023-10-20 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming metal interconnection and method of fabricating semiconductor device using the same |
| US11453943B2 (en) | 2016-05-25 | 2022-09-27 | Asm Ip Holding B.V. | Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor |
| US10388509B2 (en) | 2016-06-28 | 2019-08-20 | Asm Ip Holding B.V. | Formation of epitaxial layers via dislocation filtering |
| US9859151B1 (en) | 2016-07-08 | 2018-01-02 | Asm Ip Holding B.V. | Selective film deposition method to form air gaps |
| US10612137B2 (en) | 2016-07-08 | 2020-04-07 | Asm Ip Holdings B.V. | Organic reactants for atomic layer deposition |
| US9793135B1 (en) | 2016-07-14 | 2017-10-17 | ASM IP Holding B.V | Method of cyclic dry etching using etchant film |
| US10714385B2 (en) | 2016-07-19 | 2020-07-14 | Asm Ip Holding B.V. | Selective deposition of tungsten |
| US10381226B2 (en) | 2016-07-27 | 2019-08-13 | Asm Ip Holding B.V. | Method of processing substrate |
| US9812320B1 (en) | 2016-07-28 | 2017-11-07 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
| US10395919B2 (en) | 2016-07-28 | 2019-08-27 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
| US10177025B2 (en) | 2016-07-28 | 2019-01-08 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
| US9887082B1 (en) | 2016-07-28 | 2018-02-06 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
| KR102532607B1 (en) | 2016-07-28 | 2023-05-15 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus and method of operating the same |
| USD799646S1 (en) | 2016-08-30 | 2017-10-10 | Asm Ip Holding B.V. | Heater block |
| US10090316B2 (en) | 2016-09-01 | 2018-10-02 | Asm Ip Holding B.V. | 3D stacked multilayer semiconductor memory using doped select transistor channel |
| US10410943B2 (en) | 2016-10-13 | 2019-09-10 | Asm Ip Holding B.V. | Method for passivating a surface of a semiconductor and related systems |
| US10643826B2 (en) | 2016-10-26 | 2020-05-05 | Asm Ip Holdings B.V. | Methods for thermally calibrating reaction chambers |
| US11532757B2 (en) | 2016-10-27 | 2022-12-20 | Asm Ip Holding B.V. | Deposition of charge trapping layers |
| US10714350B2 (en) | 2016-11-01 | 2020-07-14 | ASM IP Holdings, B.V. | Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
| US10229833B2 (en) | 2016-11-01 | 2019-03-12 | Asm Ip Holding B.V. | Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
| US10435790B2 (en) | 2016-11-01 | 2019-10-08 | Asm Ip Holding B.V. | Method of subatmospheric plasma-enhanced ALD using capacitively coupled electrodes with narrow gap |
| US10643904B2 (en) | 2016-11-01 | 2020-05-05 | Asm Ip Holdings B.V. | Methods for forming a semiconductor device and related semiconductor device structures |
| US10134757B2 (en) | 2016-11-07 | 2018-11-20 | Asm Ip Holding B.V. | Method of processing a substrate and a device manufactured by using the method |
| KR102546317B1 (en) | 2016-11-15 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | Gas supply unit and substrate processing apparatus including the same |
| US10340135B2 (en) | 2016-11-28 | 2019-07-02 | Asm Ip Holding B.V. | Method of topologically restricted plasma-enhanced cyclic deposition of silicon or metal nitride |
| KR102762543B1 (en) | 2016-12-14 | 2025-02-05 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
| US9916980B1 (en) | 2016-12-15 | 2018-03-13 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
| US11447861B2 (en) | 2016-12-15 | 2022-09-20 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus and a method of forming a patterned structure |
| US11581186B2 (en) | 2016-12-15 | 2023-02-14 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus |
| KR102700194B1 (en) | 2016-12-19 | 2024-08-28 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
| US10269558B2 (en) | 2016-12-22 | 2019-04-23 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
| US10867788B2 (en) | 2016-12-28 | 2020-12-15 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
| US11390950B2 (en) | 2017-01-10 | 2022-07-19 | Asm Ip Holding B.V. | Reactor system and method to reduce residue buildup during a film deposition process |
| US10655221B2 (en) | 2017-02-09 | 2020-05-19 | Asm Ip Holding B.V. | Method for depositing oxide film by thermal ALD and PEALD |
| US10468261B2 (en) | 2017-02-15 | 2019-11-05 | Asm Ip Holding B.V. | Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures |
| US10529563B2 (en) | 2017-03-29 | 2020-01-07 | Asm Ip Holdings B.V. | Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures |
| US10283353B2 (en) | 2017-03-29 | 2019-05-07 | Asm Ip Holding B.V. | Method of reforming insulating film deposited on substrate with recess pattern |
| US10103040B1 (en) | 2017-03-31 | 2018-10-16 | Asm Ip Holding B.V. | Apparatus and method for manufacturing a semiconductor device |
| USD830981S1 (en) | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
| KR102457289B1 (en) | 2017-04-25 | 2022-10-21 | 에이에스엠 아이피 홀딩 비.브이. | Method for depositing a thin film and manufacturing a semiconductor device |
| US10446393B2 (en) | 2017-05-08 | 2019-10-15 | Asm Ip Holding B.V. | Methods for forming silicon-containing epitaxial layers and related semiconductor device structures |
| US10892156B2 (en) | 2017-05-08 | 2021-01-12 | Asm Ip Holding B.V. | Methods for forming a silicon nitride film on a substrate and related semiconductor device structures |
| US10770286B2 (en) | 2017-05-08 | 2020-09-08 | Asm Ip Holdings B.V. | Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures |
| US10504742B2 (en) | 2017-05-31 | 2019-12-10 | Asm Ip Holding B.V. | Method of atomic layer etching using hydrogen plasma |
| US10886123B2 (en) | 2017-06-02 | 2021-01-05 | Asm Ip Holding B.V. | Methods for forming low temperature semiconductor layers and related semiconductor device structures |
| US12040200B2 (en) | 2017-06-20 | 2024-07-16 | Asm Ip Holding B.V. | Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus |
| US11306395B2 (en) | 2017-06-28 | 2022-04-19 | Asm Ip Holding B.V. | Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus |
| US10685834B2 (en) | 2017-07-05 | 2020-06-16 | Asm Ip Holdings B.V. | Methods for forming a silicon germanium tin layer and related semiconductor device structures |
| KR20190009245A (en) | 2017-07-18 | 2019-01-28 | 에이에스엠 아이피 홀딩 비.브이. | Methods for forming a semiconductor device structure and related semiconductor device structures |
| US11018002B2 (en) | 2017-07-19 | 2021-05-25 | Asm Ip Holding B.V. | Method for selectively depositing a Group IV semiconductor and related semiconductor device structures |
| US11374112B2 (en) | 2017-07-19 | 2022-06-28 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
| US10541333B2 (en) | 2017-07-19 | 2020-01-21 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
| US10590535B2 (en) | 2017-07-26 | 2020-03-17 | Asm Ip Holdings B.V. | Chemical treatment, deposition and/or infiltration apparatus and method for using the same |
| US10312055B2 (en) | 2017-07-26 | 2019-06-04 | Asm Ip Holding B.V. | Method of depositing film by PEALD using negative bias |
| US10605530B2 (en) | 2017-07-26 | 2020-03-31 | Asm Ip Holding B.V. | Assembly of a liner and a flange for a vertical furnace as well as the liner and the vertical furnace |
| TWI815813B (en) | 2017-08-04 | 2023-09-21 | 荷蘭商Asm智慧財產控股公司 | Showerhead assembly for distributing a gas within a reaction chamber |
| US10692741B2 (en) | 2017-08-08 | 2020-06-23 | Asm Ip Holdings B.V. | Radiation shield |
| US10770336B2 (en) | 2017-08-08 | 2020-09-08 | Asm Ip Holding B.V. | Substrate lift mechanism and reactor including same |
| US11139191B2 (en) | 2017-08-09 | 2021-10-05 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
| US10249524B2 (en) | 2017-08-09 | 2019-04-02 | Asm Ip Holding B.V. | Cassette holder assembly for a substrate cassette and holding member for use in such assembly |
| US11769682B2 (en) | 2017-08-09 | 2023-09-26 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
| US10236177B1 (en) | 2017-08-22 | 2019-03-19 | ASM IP Holding B.V.. | Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures |
| USD900036S1 (en) | 2017-08-24 | 2020-10-27 | Asm Ip Holding B.V. | Heater electrical connector and adapter |
| US11830730B2 (en) | 2017-08-29 | 2023-11-28 | Asm Ip Holding B.V. | Layer forming method and apparatus |
| US11295980B2 (en) | 2017-08-30 | 2022-04-05 | Asm Ip Holding B.V. | Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures |
| US11056344B2 (en) | 2017-08-30 | 2021-07-06 | Asm Ip Holding B.V. | Layer forming method |
| KR102491945B1 (en) | 2017-08-30 | 2023-01-26 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
| KR102401446B1 (en) | 2017-08-31 | 2022-05-24 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
| US10607895B2 (en) | 2017-09-18 | 2020-03-31 | Asm Ip Holdings B.V. | Method for forming a semiconductor device structure comprising a gate fill metal |
| KR102630301B1 (en) | 2017-09-21 | 2024-01-29 | 에이에스엠 아이피 홀딩 비.브이. | Method of sequential infiltration synthesis treatment of infiltrateable material and structures and devices formed using same |
| US10844484B2 (en) | 2017-09-22 | 2020-11-24 | Asm Ip Holding B.V. | Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
| US10658205B2 (en) | 2017-09-28 | 2020-05-19 | Asm Ip Holdings B.V. | Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber |
| US10403504B2 (en) | 2017-10-05 | 2019-09-03 | Asm Ip Holding B.V. | Method for selectively depositing a metallic film on a substrate |
| US10319588B2 (en) | 2017-10-10 | 2019-06-11 | Asm Ip Holding B.V. | Method for depositing a metal chalcogenide on a substrate by cyclical deposition |
| US10923344B2 (en) | 2017-10-30 | 2021-02-16 | Asm Ip Holding B.V. | Methods for forming a semiconductor structure and related semiconductor structures |
| US10910262B2 (en) | 2017-11-16 | 2021-02-02 | Asm Ip Holding B.V. | Method of selectively depositing a capping layer structure on a semiconductor device structure |
| KR102443047B1 (en) | 2017-11-16 | 2022-09-14 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus method and apparatus manufactured thereby |
| US11022879B2 (en) | 2017-11-24 | 2021-06-01 | Asm Ip Holding B.V. | Method of forming an enhanced unexposed photoresist layer |
| JP7214724B2 (en) | 2017-11-27 | 2023-01-30 | エーエスエム アイピー ホールディング ビー.ブイ. | Storage device for storing wafer cassettes used in batch furnaces |
| TWI791689B (en) | 2017-11-27 | 2023-02-11 | 荷蘭商Asm智慧財產控股私人有限公司 | Apparatus including a clean mini environment |
| US10290508B1 (en) | 2017-12-05 | 2019-05-14 | Asm Ip Holding B.V. | Method for forming vertical spacers for spacer-defined patterning |
| US10872771B2 (en) | 2018-01-16 | 2020-12-22 | Asm Ip Holding B. V. | Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures |
| TWI799494B (en) | 2018-01-19 | 2023-04-21 | 荷蘭商Asm 智慧財產控股公司 | Deposition method |
| KR102695659B1 (en) | 2018-01-19 | 2024-08-14 | 에이에스엠 아이피 홀딩 비.브이. | Method for depositing a gap filling layer by plasma assisted deposition |
| USD903477S1 (en) | 2018-01-24 | 2020-12-01 | Asm Ip Holdings B.V. | Metal clamp |
| US11018047B2 (en) | 2018-01-25 | 2021-05-25 | Asm Ip Holding B.V. | Hybrid lift pin |
| USD880437S1 (en) | 2018-02-01 | 2020-04-07 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
| US10535516B2 (en) | 2018-02-01 | 2020-01-14 | Asm Ip Holdings B.V. | Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures |
| US11081345B2 (en) | 2018-02-06 | 2021-08-03 | Asm Ip Holding B.V. | Method of post-deposition treatment for silicon oxide film |
| US11685991B2 (en) | 2018-02-14 | 2023-06-27 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
| US10896820B2 (en) | 2018-02-14 | 2021-01-19 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
| US10731249B2 (en) | 2018-02-15 | 2020-08-04 | Asm Ip Holding B.V. | Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus |
| US10658181B2 (en) | 2018-02-20 | 2020-05-19 | Asm Ip Holding B.V. | Method of spacer-defined direct patterning in semiconductor fabrication |
| KR102636427B1 (en) | 2018-02-20 | 2024-02-13 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing method and apparatus |
| US10975470B2 (en) | 2018-02-23 | 2021-04-13 | Asm Ip Holding B.V. | Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment |
| US11473195B2 (en) | 2018-03-01 | 2022-10-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus and a method for processing a substrate |
| US11629406B2 (en) | 2018-03-09 | 2023-04-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate |
| US11114283B2 (en) | 2018-03-16 | 2021-09-07 | Asm Ip Holding B.V. | Reactor, system including the reactor, and methods of manufacturing and using same |
| KR102646467B1 (en) | 2018-03-27 | 2024-03-11 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming an electrode on a substrate and a semiconductor device structure including an electrode |
| US11230766B2 (en) | 2018-03-29 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
| US11088002B2 (en) | 2018-03-29 | 2021-08-10 | Asm Ip Holding B.V. | Substrate rack and a substrate processing system and method |
| US10510536B2 (en) | 2018-03-29 | 2019-12-17 | Asm Ip Holding B.V. | Method of depositing a co-doped polysilicon film on a surface of a substrate within a reaction chamber |
| KR102501472B1 (en) | 2018-03-30 | 2023-02-20 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing method |
| KR102600229B1 (en) | 2018-04-09 | 2023-11-10 | 에이에스엠 아이피 홀딩 비.브이. | Substrate supporting device, substrate processing apparatus including the same and substrate processing method |
| TWI843623B (en) | 2018-05-08 | 2024-05-21 | 荷蘭商Asm Ip私人控股有限公司 | Methods for depositing an oxide film on a substrate by a cyclical deposition process and related device structures |
| US12025484B2 (en) | 2018-05-08 | 2024-07-02 | Asm Ip Holding B.V. | Thin film forming method |
| US12272527B2 (en) | 2018-05-09 | 2025-04-08 | Asm Ip Holding B.V. | Apparatus for use with hydrogen radicals and method of using same |
| KR20190129718A (en) | 2018-05-11 | 2019-11-20 | 에이에스엠 아이피 홀딩 비.브이. | Methods for forming a doped metal carbide film on a substrate and related semiconductor device structures |
| KR102596988B1 (en) | 2018-05-28 | 2023-10-31 | 에이에스엠 아이피 홀딩 비.브이. | Method of processing a substrate and a device manufactured by the same |
| TWI840362B (en) | 2018-06-04 | 2024-05-01 | 荷蘭商Asm Ip私人控股有限公司 | Wafer handling chamber with moisture reduction |
| US11718913B2 (en) | 2018-06-04 | 2023-08-08 | Asm Ip Holding B.V. | Gas distribution system and reactor system including same |
| US11286562B2 (en) | 2018-06-08 | 2022-03-29 | Asm Ip Holding B.V. | Gas-phase chemical reactor and method of using same |
| KR102568797B1 (en) | 2018-06-21 | 2023-08-21 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing system |
| US10797133B2 (en) | 2018-06-21 | 2020-10-06 | Asm Ip Holding B.V. | Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures |
| TWI871083B (en) | 2018-06-27 | 2025-01-21 | 荷蘭商Asm Ip私人控股有限公司 | Cyclic deposition processes for forming metal-containing material |
| US11499222B2 (en) | 2018-06-27 | 2022-11-15 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
| US10612136B2 (en) | 2018-06-29 | 2020-04-07 | ASM IP Holding, B.V. | Temperature-controlled flange and reactor system including same |
| KR102686758B1 (en) | 2018-06-29 | 2024-07-18 | 에이에스엠 아이피 홀딩 비.브이. | Method for depositing a thin film and manufacturing a semiconductor device |
| US10755922B2 (en) | 2018-07-03 | 2020-08-25 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
| US10388513B1 (en) | 2018-07-03 | 2019-08-20 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
| US10767789B2 (en) | 2018-07-16 | 2020-09-08 | Asm Ip Holding B.V. | Diaphragm valves, valve components, and methods for forming valve components |
| US10483099B1 (en) | 2018-07-26 | 2019-11-19 | Asm Ip Holding B.V. | Method for forming thermally stable organosilicon polymer film |
| US11053591B2 (en) | 2018-08-06 | 2021-07-06 | Asm Ip Holding B.V. | Multi-port gas injection system and reactor system including same |
| US10883175B2 (en) | 2018-08-09 | 2021-01-05 | Asm Ip Holding B.V. | Vertical furnace for processing substrates and a liner for use therein |
| US10829852B2 (en) | 2018-08-16 | 2020-11-10 | Asm Ip Holding B.V. | Gas distribution device for a wafer processing apparatus |
| US11430674B2 (en) | 2018-08-22 | 2022-08-30 | Asm Ip Holding B.V. | Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
| US11024523B2 (en) | 2018-09-11 | 2021-06-01 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
| KR102707956B1 (en) | 2018-09-11 | 2024-09-19 | 에이에스엠 아이피 홀딩 비.브이. | Method for deposition of a thin film |
| US11049751B2 (en) | 2018-09-14 | 2021-06-29 | Asm Ip Holding B.V. | Cassette supply system to store and handle cassettes and processing apparatus equipped therewith |
| CN110970344B (en) | 2018-10-01 | 2024-10-25 | Asmip控股有限公司 | Substrate holding device, system including the same and method of using the same |
| US11232963B2 (en) | 2018-10-03 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
| KR102592699B1 (en) | 2018-10-08 | 2023-10-23 | 에이에스엠 아이피 홀딩 비.브이. | Substrate support unit and apparatuses for depositing thin film and processing the substrate including the same |
| US10847365B2 (en) | 2018-10-11 | 2020-11-24 | Asm Ip Holding B.V. | Method of forming conformal silicon carbide film by cyclic CVD |
| US10811256B2 (en) | 2018-10-16 | 2020-10-20 | Asm Ip Holding B.V. | Method for etching a carbon-containing feature |
| KR102546322B1 (en) | 2018-10-19 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus and substrate processing method |
| KR102605121B1 (en) | 2018-10-19 | 2023-11-23 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus and substrate processing method |
| USD948463S1 (en) | 2018-10-24 | 2022-04-12 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate supporting apparatus |
| US10381219B1 (en) | 2018-10-25 | 2019-08-13 | Asm Ip Holding B.V. | Methods for forming a silicon nitride film |
| US12378665B2 (en) | 2018-10-26 | 2025-08-05 | Asm Ip Holding B.V. | High temperature coatings for a preclean and etch apparatus and related methods |
| US11087997B2 (en) | 2018-10-31 | 2021-08-10 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
| KR102748291B1 (en) | 2018-11-02 | 2024-12-31 | 에이에스엠 아이피 홀딩 비.브이. | Substrate support unit and substrate processing apparatus including the same |
| US11572620B2 (en) | 2018-11-06 | 2023-02-07 | Asm Ip Holding B.V. | Methods for selectively depositing an amorphous silicon film on a substrate |
| US11031242B2 (en) | 2018-11-07 | 2021-06-08 | Asm Ip Holding B.V. | Methods for depositing a boron doped silicon germanium film |
| US10847366B2 (en) | 2018-11-16 | 2020-11-24 | Asm Ip Holding B.V. | Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process |
| US10818758B2 (en) | 2018-11-16 | 2020-10-27 | Asm Ip Holding B.V. | Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures |
| US10559458B1 (en) | 2018-11-26 | 2020-02-11 | Asm Ip Holding B.V. | Method of forming oxynitride film |
| US12040199B2 (en) | 2018-11-28 | 2024-07-16 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
| US11217444B2 (en) | 2018-11-30 | 2022-01-04 | Asm Ip Holding B.V. | Method for forming an ultraviolet radiation responsive metal oxide-containing film |
| KR102636428B1 (en) | 2018-12-04 | 2024-02-13 | 에이에스엠 아이피 홀딩 비.브이. | A method for cleaning a substrate processing apparatus |
| US11158513B2 (en) | 2018-12-13 | 2021-10-26 | Asm Ip Holding B.V. | Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures |
| JP7504584B2 (en) | 2018-12-14 | 2024-06-24 | エーエスエム・アイピー・ホールディング・ベー・フェー | Method and system for forming device structures using selective deposition of gallium nitride - Patents.com |
| TWI866480B (en) | 2019-01-17 | 2024-12-11 | 荷蘭商Asm Ip 私人控股有限公司 | Methods of forming a transition metal containing film on a substrate by a cyclical deposition process |
| KR102727227B1 (en) | 2019-01-22 | 2024-11-07 | 에이에스엠 아이피 홀딩 비.브이. | Semiconductor processing device |
| CN111524788B (en) | 2019-02-01 | 2023-11-24 | Asm Ip私人控股有限公司 | Method for forming topologically selective films of silicon oxide |
| TWI873122B (en) | 2019-02-20 | 2025-02-21 | 荷蘭商Asm Ip私人控股有限公司 | Method of filling a recess formed within a surface of a substrate, semiconductor structure formed according to the method, and semiconductor processing apparatus |
| KR102626263B1 (en) | 2019-02-20 | 2024-01-16 | 에이에스엠 아이피 홀딩 비.브이. | Cyclical deposition method including treatment step and apparatus for same |
| TWI845607B (en) | 2019-02-20 | 2024-06-21 | 荷蘭商Asm Ip私人控股有限公司 | Cyclical deposition method and apparatus for filling a recess formed within a substrate surface |
| KR20200102357A (en) | 2019-02-20 | 2020-08-31 | 에이에스엠 아이피 홀딩 비.브이. | Apparatus and methods for plug fill deposition in 3-d nand applications |
| TWI842826B (en) | 2019-02-22 | 2024-05-21 | 荷蘭商Asm Ip私人控股有限公司 | Substrate processing apparatus and method for processing substrate |
| KR102762833B1 (en) | 2019-03-08 | 2025-02-04 | 에이에스엠 아이피 홀딩 비.브이. | STRUCTURE INCLUDING SiOCN LAYER AND METHOD OF FORMING SAME |
| KR102858005B1 (en) | 2019-03-08 | 2025-09-09 | 에이에스엠 아이피 홀딩 비.브이. | Method for Selective Deposition of Silicon Nitride Layer and Structure Including Selectively-Deposited Silicon Nitride Layer |
| KR102782593B1 (en) | 2019-03-08 | 2025-03-14 | 에이에스엠 아이피 홀딩 비.브이. | Structure Including SiOC Layer and Method of Forming Same |
| JP2020167398A (en) | 2019-03-28 | 2020-10-08 | エーエスエム・アイピー・ホールディング・ベー・フェー | Door openers and substrate processing equipment provided with door openers |
| KR102809999B1 (en) | 2019-04-01 | 2025-05-19 | 에이에스엠 아이피 홀딩 비.브이. | Method of manufacturing semiconductor device |
| KR102897355B1 (en) | 2019-04-19 | 2025-12-08 | 에이에스엠 아이피 홀딩 비.브이. | Layer forming method and apparatus |
| KR20200125453A (en) | 2019-04-24 | 2020-11-04 | 에이에스엠 아이피 홀딩 비.브이. | Gas-phase reactor system and method of using same |
| KR102869364B1 (en) | 2019-05-07 | 2025-10-10 | 에이에스엠 아이피 홀딩 비.브이. | Method for Reforming Amorphous Carbon Polymer Film |
| KR102929471B1 (en) | 2019-05-07 | 2026-02-20 | 에이에스엠 아이피 홀딩 비.브이. | Chemical source vessel with dip tube |
| KR102929472B1 (en) | 2019-05-10 | 2026-02-20 | 에이에스엠 아이피 홀딩 비.브이. | Method of depositing material onto a surface and structure formed according to the method |
| JP7612342B2 (en) | 2019-05-16 | 2025-01-14 | エーエスエム・アイピー・ホールディング・ベー・フェー | Wafer boat handling apparatus, vertical batch furnace and method |
| JP7598201B2 (en) | 2019-05-16 | 2024-12-11 | エーエスエム・アイピー・ホールディング・ベー・フェー | Wafer boat handling apparatus, vertical batch furnace and method |
| USD975665S1 (en) | 2019-05-17 | 2023-01-17 | Asm Ip Holding B.V. | Susceptor shaft |
| USD947913S1 (en) | 2019-05-17 | 2022-04-05 | Asm Ip Holding B.V. | Susceptor shaft |
| USD935572S1 (en) | 2019-05-24 | 2021-11-09 | Asm Ip Holding B.V. | Gas channel plate |
| USD922229S1 (en) | 2019-06-05 | 2021-06-15 | Asm Ip Holding B.V. | Device for controlling a temperature of a gas supply unit |
| KR20200141002A (en) | 2019-06-06 | 2020-12-17 | 에이에스엠 아이피 홀딩 비.브이. | Method of using a gas-phase reactor system including analyzing exhausted gas |
| KR102918757B1 (en) | 2019-06-10 | 2026-01-28 | 에이에스엠 아이피 홀딩 비.브이. | Method for cleaning quartz epitaxial chambers |
| KR20200143254A (en) | 2019-06-11 | 2020-12-23 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming an electronic structure using an reforming gas, system for performing the method, and structure formed using the method |
| USD944946S1 (en) | 2019-06-14 | 2022-03-01 | Asm Ip Holding B.V. | Shower plate |
| USD931978S1 (en) | 2019-06-27 | 2021-09-28 | Asm Ip Holding B.V. | Showerhead vacuum transport |
| KR102911421B1 (en) | 2019-07-03 | 2026-01-12 | 에이에스엠 아이피 홀딩 비.브이. | Temperature control assembly for substrate processing apparatus and method of using same |
| JP7499079B2 (en) | 2019-07-09 | 2024-06-13 | エーエスエム・アイピー・ホールディング・ベー・フェー | Plasma device using coaxial waveguide and substrate processing method |
| CN112216646B (en) | 2019-07-10 | 2026-02-10 | Asmip私人控股有限公司 | Substrate support assembly and substrate processing apparatus including the thereof |
| KR102895115B1 (en) | 2019-07-16 | 2025-12-03 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
| TWI826704B (en) | 2019-07-17 | 2023-12-21 | 荷蘭商Asm Ip私人控股有限公司 | Radical assist ignition plasma system and method |
| KR102860110B1 (en) | 2019-07-17 | 2025-09-16 | 에이에스엠 아이피 홀딩 비.브이. | Methods of forming silicon germanium structures |
| US11643724B2 (en) | 2019-07-18 | 2023-05-09 | Asm Ip Holding B.V. | Method of forming structures using a neutral beam |
| TWI839544B (en) | 2019-07-19 | 2024-04-21 | 荷蘭商Asm Ip私人控股有限公司 | Method of forming topology-controlled amorphous carbon polymer film |
| KR102903090B1 (en) | 2019-07-19 | 2025-12-19 | 에이에스엠 아이피 홀딩 비.브이. | Method of Forming Topology-Controlled Amorphous Carbon Polymer Film |
| CN112309843B (en) | 2019-07-29 | 2026-01-23 | Asmip私人控股有限公司 | Selective deposition method for achieving high dopant incorporation |
| CN112309900B (en) | 2019-07-30 | 2025-11-04 | Asmip私人控股有限公司 | Substrate processing equipment |
| CN112309899B (en) | 2019-07-30 | 2025-11-14 | Asmip私人控股有限公司 | Substrate processing equipment |
| KR20210015655A (en) | 2019-07-30 | 2021-02-10 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus and method |
| US11587814B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
| US11227782B2 (en) | 2019-07-31 | 2022-01-18 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
| US11587815B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
| KR20210018759A (en) | 2019-08-05 | 2021-02-18 | 에이에스엠 아이피 홀딩 비.브이. | Liquid level sensor for a chemical source vessel |
| KR20210018761A (en) | 2019-08-09 | 2021-02-18 | 에이에스엠 아이피 홀딩 비.브이. | heater assembly including cooling apparatus and method of using same |
| USD965524S1 (en) | 2019-08-19 | 2022-10-04 | Asm Ip Holding B.V. | Susceptor support |
| USD965044S1 (en) | 2019-08-19 | 2022-09-27 | Asm Ip Holding B.V. | Susceptor shaft |
| JP7810514B2 (en) | 2019-08-21 | 2026-02-03 | エーエスエム・アイピー・ホールディング・ベー・フェー | Film-forming raw material mixed gas generating device and film-forming device |
| USD979506S1 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Insulator |
| USD949319S1 (en) | 2019-08-22 | 2022-04-19 | Asm Ip Holding B.V. | Exhaust duct |
| USD940837S1 (en) | 2019-08-22 | 2022-01-11 | Asm Ip Holding B.V. | Electrode |
| KR20210024423A (en) | 2019-08-22 | 2021-03-05 | 에이에스엠 아이피 홀딩 비.브이. | Method for forming a structure with a hole |
| USD930782S1 (en) | 2019-08-22 | 2021-09-14 | Asm Ip Holding B.V. | Gas distributor |
| US11286558B2 (en) | 2019-08-23 | 2022-03-29 | Asm Ip Holding B.V. | Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film |
| KR102928101B1 (en) | 2019-08-23 | 2026-02-13 | 에이에스엠 아이피 홀딩 비.브이. | Method for depositing silicon oxide film having improved quality by peald using bis(diethylamino)silane |
| KR102868968B1 (en) | 2019-09-03 | 2025-10-10 | 에이에스엠 아이피 홀딩 비.브이. | Methods and apparatus for depositing a chalcogenide film and structures including the film |
| KR102806450B1 (en) | 2019-09-04 | 2025-05-12 | 에이에스엠 아이피 홀딩 비.브이. | Methods for selective deposition using a sacrificial capping layer |
| KR102733104B1 (en) | 2019-09-05 | 2024-11-22 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
| US12469693B2 (en) | 2019-09-17 | 2025-11-11 | Asm Ip Holding B.V. | Method of forming a carbon-containing layer and structure including the layer |
| US11562901B2 (en) | 2019-09-25 | 2023-01-24 | Asm Ip Holding B.V. | Substrate processing method |
| CN112593212B (en) | 2019-10-02 | 2023-12-22 | Asm Ip私人控股有限公司 | Method for forming topologically selective silicon oxide film through cyclic plasma enhanced deposition process |
| KR102948143B1 (en) | 2019-10-08 | 2026-04-07 | 에이에스엠 아이피 홀딩 비.브이. | Reactor system including a gas distribution assembly for use with activated species and method of using same |
| TWI846953B (en) | 2019-10-08 | 2024-07-01 | 荷蘭商Asm Ip私人控股有限公司 | Substrate processing device |
| TW202128273A (en) | 2019-10-08 | 2021-08-01 | 荷蘭商Asm Ip私人控股有限公司 | Gas injection system, reactor system, and method of depositing material on surface of substratewithin reaction chamber |
| TWI846966B (en) | 2019-10-10 | 2024-07-01 | 荷蘭商Asm Ip私人控股有限公司 | Method of forming a photoresist underlayer and structure including same |
| US12009241B2 (en) | 2019-10-14 | 2024-06-11 | Asm Ip Holding B.V. | Vertical batch furnace assembly with detector to detect cassette |
| TWI834919B (en) | 2019-10-16 | 2024-03-11 | 荷蘭商Asm Ip私人控股有限公司 | Method of topology-selective film formation of silicon oxide |
| US11637014B2 (en) | 2019-10-17 | 2023-04-25 | Asm Ip Holding B.V. | Methods for selective deposition of doped semiconductor material |
| KR102845724B1 (en) | 2019-10-21 | 2025-08-13 | 에이에스엠 아이피 홀딩 비.브이. | Apparatus and methods for selectively etching films |
| US11996292B2 (en) | 2019-10-25 | 2024-05-28 | Asm Ip Holding B.V. | Methods for filling a gap feature on a substrate surface and related semiconductor structures |
| US11646205B2 (en) | 2019-10-29 | 2023-05-09 | Asm Ip Holding B.V. | Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same |
| KR102890638B1 (en) | 2019-11-05 | 2025-11-25 | 에이에스엠 아이피 홀딩 비.브이. | Structures with doped semiconductor layers and methods and systems for forming same |
| US11501968B2 (en) | 2019-11-15 | 2022-11-15 | Asm Ip Holding B.V. | Method for providing a semiconductor device with silicon filled gaps |
| KR102861314B1 (en) | 2019-11-20 | 2025-09-17 | 에이에스엠 아이피 홀딩 비.브이. | Method of depositing carbon-containing material on a surface of a substrate, structure formed using the method, and system for forming the structure |
| KR20210065848A (en) | 2019-11-26 | 2021-06-04 | 에이에스엠 아이피 홀딩 비.브이. | Methods for selectivley forming a target film on a substrate comprising a first dielectric surface and a second metallic surface |
| CN112951697B (en) | 2019-11-26 | 2025-07-29 | Asmip私人控股有限公司 | Substrate processing apparatus |
| CN112885692B (en) | 2019-11-29 | 2025-08-15 | Asmip私人控股有限公司 | Substrate processing apparatus |
| CN120432376A (en) | 2019-11-29 | 2025-08-05 | Asm Ip私人控股有限公司 | Substrate processing equipment |
| JP7527928B2 (en) | 2019-12-02 | 2024-08-05 | エーエスエム・アイピー・ホールディング・ベー・フェー | Substrate processing apparatus and substrate processing method |
| KR20210070898A (en) | 2019-12-04 | 2021-06-15 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
| US11885013B2 (en) | 2019-12-17 | 2024-01-30 | Asm Ip Holding B.V. | Method of forming vanadium nitride layer and structure including the vanadium nitride layer |
| KR102943768B1 (en) | 2019-12-19 | 2026-03-26 | 에이에스엠 아이피 홀딩 비.브이. | Methods for filling a gap feature on a substrate and related semiconductor structures |
| TWI887322B (en) | 2020-01-06 | 2025-06-21 | 荷蘭商Asm Ip私人控股有限公司 | Reactor system, lift pin, and processing method |
| JP7730637B2 (en) | 2020-01-06 | 2025-08-28 | エーエスエム・アイピー・ホールディング・ベー・フェー | Gas delivery assembly, components thereof, and reactor system including same |
| US11993847B2 (en) | 2020-01-08 | 2024-05-28 | Asm Ip Holding B.V. | Injector |
| KR102882467B1 (en) | 2020-01-16 | 2025-11-05 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming high aspect ratio features |
| KR102675856B1 (en) | 2020-01-20 | 2024-06-17 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming thin film and method of modifying surface of thin film |
| TWI889744B (en) | 2020-01-29 | 2025-07-11 | 荷蘭商Asm Ip私人控股有限公司 | Contaminant trap system, and baffle plate stack |
| TW202513845A (en) | 2020-02-03 | 2025-04-01 | 荷蘭商Asm Ip私人控股有限公司 | Semiconductor structures and methods for forming the same |
| KR20210100010A (en) | 2020-02-04 | 2021-08-13 | 에이에스엠 아이피 홀딩 비.브이. | Method and apparatus for transmittance measurements of large articles |
| US11776846B2 (en) | 2020-02-07 | 2023-10-03 | Asm Ip Holding B.V. | Methods for depositing gap filling fluids and related systems and devices |
| KR102916725B1 (en) | 2020-02-13 | 2026-01-23 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus including light receiving device and calibration method of light receiving device |
| KR20210103953A (en) | 2020-02-13 | 2021-08-24 | 에이에스엠 아이피 홀딩 비.브이. | Gas distribution assembly and method of using same |
| US11781243B2 (en) | 2020-02-17 | 2023-10-10 | Asm Ip Holding B.V. | Method for depositing low temperature phosphorous-doped silicon |
| TWI895326B (en) | 2020-02-28 | 2025-09-01 | 荷蘭商Asm Ip私人控股有限公司 | System dedicated for parts cleaning |
| KR102943116B1 (en) | 2020-03-04 | 2026-03-23 | 에이에스엠 아이피 홀딩 비.브이. | Alignment fixture for a reactor system |
| KR20210116240A (en) | 2020-03-11 | 2021-09-27 | 에이에스엠 아이피 홀딩 비.브이. | Substrate handling device with adjustable joints |
| US11876356B2 (en) | 2020-03-11 | 2024-01-16 | Asm Ip Holding B.V. | Lockout tagout assembly and system and method of using same |
| KR102775390B1 (en) | 2020-03-12 | 2025-02-28 | 에이에스엠 아이피 홀딩 비.브이. | Method for Fabricating Layer Structure Having Target Topological Profile |
| US12173404B2 (en) | 2020-03-17 | 2024-12-24 | Asm Ip Holding B.V. | Method of depositing epitaxial material, structure formed using the method, and system for performing the method |
| KR102755229B1 (en) | 2020-04-02 | 2025-01-14 | 에이에스엠 아이피 홀딩 비.브이. | Thin film forming method |
| TWI887376B (en) | 2020-04-03 | 2025-06-21 | 荷蘭商Asm Ip私人控股有限公司 | Method for manufacturing semiconductor device |
| TWI888525B (en) | 2020-04-08 | 2025-07-01 | 荷蘭商Asm Ip私人控股有限公司 | Apparatus and methods for selectively etching silcon oxide films |
| KR20210128343A (en) | 2020-04-15 | 2021-10-26 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming chromium nitride layer and structure including the chromium nitride layer |
| US11821078B2 (en) | 2020-04-15 | 2023-11-21 | Asm Ip Holding B.V. | Method for forming precoat film and method for forming silicon-containing film |
| US11996289B2 (en) | 2020-04-16 | 2024-05-28 | Asm Ip Holding B.V. | Methods of forming structures including silicon germanium and silicon layers, devices formed using the methods, and systems for performing the methods |
| KR102901748B1 (en) | 2020-04-21 | 2025-12-17 | 에이에스엠 아이피 홀딩 비.브이. | Method for processing a substrate |
| KR102866804B1 (en) | 2020-04-24 | 2025-09-30 | 에이에스엠 아이피 홀딩 비.브이. | Vertical batch furnace assembly comprising a cooling gas supply |
| KR20210132600A (en) | 2020-04-24 | 2021-11-04 | 에이에스엠 아이피 홀딩 비.브이. | Methods and systems for depositing a layer comprising vanadium, nitrogen, and a further element |
| CN113555279A (en) | 2020-04-24 | 2021-10-26 | Asm Ip私人控股有限公司 | Methods of forming vanadium nitride-containing layers and structures comprising the same |
| TW202539998A (en) | 2020-04-24 | 2025-10-16 | 荷蘭商Asm Ip私人控股有限公司 | Compositions and vessels including vanadium compounds, and methods and systems for stabilizing vanadium compounds |
| KR102934380B1 (en) | 2020-04-24 | 2026-03-05 | 에이에스엠 아이피 홀딩 비.브이. | Methods of forming structures including vanadium boride and vanadium phosphide layers |
| KR102783898B1 (en) | 2020-04-29 | 2025-03-18 | 에이에스엠 아이피 홀딩 비.브이. | Solid source precursor vessel |
| KR20210134869A (en) | 2020-05-01 | 2021-11-11 | 에이에스엠 아이피 홀딩 비.브이. | Fast FOUP swapping with a FOUP handler |
| JP7726664B2 (en) | 2020-05-04 | 2025-08-20 | エーエスエム・アイピー・ホールディング・ベー・フェー | Substrate processing system for processing a substrate |
| JP7736446B2 (en) | 2020-05-07 | 2025-09-09 | エーエスエム・アイピー・ホールディング・ベー・フェー | Reactor system with tuned circuit |
| KR102788543B1 (en) | 2020-05-13 | 2025-03-27 | 에이에스엠 아이피 홀딩 비.브이. | Laser alignment fixture for a reactor system |
| KR102936676B1 (en) | 2020-05-15 | 2026-03-10 | 에이에스엠 아이피 홀딩 비.브이. | Methods for silicon germanium uniformity control using multiple precursors |
| KR102905441B1 (en) | 2020-05-19 | 2025-12-30 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
| KR102795476B1 (en) | 2020-05-21 | 2025-04-11 | 에이에스엠 아이피 홀딩 비.브이. | Structures including multiple carbon layers and methods of forming and using same |
| KR20210145079A (en) | 2020-05-21 | 2021-12-01 | 에이에스엠 아이피 홀딩 비.브이. | Flange and apparatus for processing substrates |
| TWI873343B (en) | 2020-05-22 | 2025-02-21 | 荷蘭商Asm Ip私人控股有限公司 | Reaction system for forming thin film on substrate |
| KR20210146802A (en) | 2020-05-26 | 2021-12-06 | 에이에스엠 아이피 홀딩 비.브이. | Method for depositing boron and gallium containing silicon germanium layers |
| TWI876048B (en) | 2020-05-29 | 2025-03-11 | 荷蘭商Asm Ip私人控股有限公司 | Substrate processing device |
| TW202212620A (en) | 2020-06-02 | 2022-04-01 | 荷蘭商Asm Ip私人控股有限公司 | Apparatus for processing substrate, method of forming film, and method of controlling apparatus for processing substrate |
| KR20210156219A (en) | 2020-06-16 | 2021-12-24 | 에이에스엠 아이피 홀딩 비.브이. | Method for depositing boron containing silicon germanium layers |
| TWI908816B (en) | 2020-06-24 | 2025-12-21 | 荷蘭商Asm Ip私人控股有限公司 | Method for forming a layer provided with silicon |
| TWI873359B (en) | 2020-06-30 | 2025-02-21 | 荷蘭商Asm Ip私人控股有限公司 | Substrate processing method |
| US12431354B2 (en) | 2020-07-01 | 2025-09-30 | Asm Ip Holding B.V. | Silicon nitride and silicon oxide deposition methods using fluorine inhibitor |
| KR102707957B1 (en) | 2020-07-08 | 2024-09-19 | 에이에스엠 아이피 홀딩 비.브이. | Method for processing a substrate |
| KR20220010438A (en) | 2020-07-17 | 2022-01-25 | 에이에스엠 아이피 홀딩 비.브이. | Structures and methods for use in photolithography |
| KR20220011092A (en) | 2020-07-20 | 2022-01-27 | 에이에스엠 아이피 홀딩 비.브이. | Method and system for forming structures including transition metal layers |
| TWI878570B (en) | 2020-07-20 | 2025-04-01 | 荷蘭商Asm Ip私人控股有限公司 | Method and system for depositing molybdenum layers |
| TW202219303A (en) | 2020-07-27 | 2022-05-16 | 荷蘭商Asm Ip私人控股有限公司 | Thin film deposition process |
| KR20220020210A (en) | 2020-08-11 | 2022-02-18 | 에이에스엠 아이피 홀딩 비.브이. | Methods for Depositing a Titinum Aluminun Carbide Film Structuru on a Substrate and Releated Semiconductor Structures |
| KR102915124B1 (en) | 2020-08-14 | 2026-01-19 | 에이에스엠 아이피 홀딩 비.브이. | Method for processing a substrate |
| US12040177B2 (en) | 2020-08-18 | 2024-07-16 | Asm Ip Holding B.V. | Methods for forming a laminate film by cyclical plasma-enhanced deposition processes |
| TWI911263B (en) | 2020-08-25 | 2026-01-11 | 荷蘭商Asm Ip私人控股有限公司 | Method for cleaning a substrate, method for selectively depositing, and reaction system |
| TW202534193A (en) | 2020-08-26 | 2025-09-01 | 荷蘭商Asm Ip私人控股有限公司 | Method of forming metal silicon oxide layer and metal silicon oxynitride layer |
| TWI911265B (en) | 2020-08-27 | 2026-01-11 | 荷蘭商Asm Ip私人控股有限公司 | Method of forming patterned structures, method of manipulating mechanical property, and device structure |
| TWI904232B (en) | 2020-09-10 | 2025-11-11 | 荷蘭商Asm Ip私人控股有限公司 | Methods for depositing gap filing fluids and related systems and devices |
| USD990534S1 (en) | 2020-09-11 | 2023-06-27 | Asm Ip Holding B.V. | Weighted lift pin |
| KR20220036866A (en) | 2020-09-16 | 2022-03-23 | 에이에스엠 아이피 홀딩 비.브이. | Silicon oxide deposition method |
| USD1012873S1 (en) | 2020-09-24 | 2024-01-30 | Asm Ip Holding B.V. | Electrode for semiconductor processing apparatus |
| TWI889903B (en) | 2020-09-25 | 2025-07-11 | 荷蘭商Asm Ip私人控股有限公司 | Semiconductor processing method |
| US12009224B2 (en) | 2020-09-29 | 2024-06-11 | Asm Ip Holding B.V. | Apparatus and method for etching metal nitrides |
| KR20220045900A (en) | 2020-10-06 | 2022-04-13 | 에이에스엠 아이피 홀딩 비.브이. | Deposition method and an apparatus for depositing a silicon-containing material |
| TW202229612A (en) | 2020-10-06 | 2022-08-01 | 荷蘭商Asm Ip私人控股有限公司 | Method and system for forming silicon nitride on a sidewall of a feature |
| CN114293174A (en) | 2020-10-07 | 2022-04-08 | Asm Ip私人控股有限公司 | Gas supply unit and substrate processing apparatus including the same |
| KR102855834B1 (en) | 2020-10-14 | 2025-09-04 | 에이에스엠 아이피 홀딩 비.브이. | Method of Depositing Material on Stepped Structure |
| KR102873665B1 (en) | 2020-10-15 | 2025-10-17 | 에이에스엠 아이피 홀딩 비.브이. | Method of manufacturing semiconductor device, and substrate treatment apparatus using ether-cat |
| TW202217037A (en) | 2020-10-22 | 2022-05-01 | 荷蘭商Asm Ip私人控股有限公司 | Method of depositing vanadium metal, structure, device and a deposition assembly |
| TW202223136A (en) | 2020-10-28 | 2022-06-16 | 荷蘭商Asm Ip私人控股有限公司 | Method for forming layer on substrate, and semiconductor processing system |
| TW202229620A (en) | 2020-11-12 | 2022-08-01 | 特文特大學 | Deposition system, method for controlling reaction condition, method for depositing |
| TW202229795A (en) | 2020-11-23 | 2022-08-01 | 荷蘭商Asm Ip私人控股有限公司 | A substrate processing apparatus with an injector |
| TW202235649A (en) | 2020-11-24 | 2022-09-16 | 荷蘭商Asm Ip私人控股有限公司 | Methods for filling a gap and related systems and devices |
| TW202235675A (en) | 2020-11-30 | 2022-09-16 | 荷蘭商Asm Ip私人控股有限公司 | Injector, and substrate processing apparatus |
| KR20220077875A (en) | 2020-12-02 | 2022-06-09 | 에이에스엠 아이피 홀딩 비.브이. | Cleaning fixture for showerhead assemblies |
| US12255053B2 (en) | 2020-12-10 | 2025-03-18 | Asm Ip Holding B.V. | Methods and systems for depositing a layer |
| US12159788B2 (en) | 2020-12-14 | 2024-12-03 | Asm Ip Holding B.V. | Method of forming structures for threshold voltage control |
| CN114639631A (en) | 2020-12-16 | 2022-06-17 | Asm Ip私人控股有限公司 | Fixing device for measuring jumping and swinging |
| TW202232639A (en) | 2020-12-18 | 2022-08-16 | 荷蘭商Asm Ip私人控股有限公司 | Wafer processing apparatus with a rotatable table |
| KR20220090435A (en) | 2020-12-22 | 2022-06-29 | 에이에스엠 아이피 홀딩 비.브이. | Precursor capsule, vessel and method |
| TW202226899A (en) | 2020-12-22 | 2022-07-01 | 荷蘭商Asm Ip私人控股有限公司 | Plasma treatment device having matching box |
| KR20220090438A (en) | 2020-12-22 | 2022-06-29 | 에이에스엠 아이피 홀딩 비.브이. | Transition metal deposition method |
| KR102335630B1 (en) * | 2021-04-20 | 2021-12-08 | (주)앤피에스 | Heat source device, substrate support device and substrate processing facility |
| USD980813S1 (en) | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas flow control plate for substrate processing apparatus |
| USD980814S1 (en) | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas distributor for substrate processing apparatus |
| USD981973S1 (en) | 2021-05-11 | 2023-03-28 | Asm Ip Holding B.V. | Reactor wall for substrate processing apparatus |
| USD1023959S1 (en) | 2021-05-11 | 2024-04-23 | Asm Ip Holding B.V. | Electrode for substrate processing apparatus |
| USD990441S1 (en) | 2021-09-07 | 2023-06-27 | Asm Ip Holding B.V. | Gas flow control plate |
| USD1099184S1 (en) | 2021-11-29 | 2025-10-21 | Asm Ip Holding B.V. | Weighted lift pin |
| USD1060598S1 (en) | 2021-12-03 | 2025-02-04 | Asm Ip Holding B.V. | Split showerhead cover |
| US12391389B2 (en) * | 2022-10-07 | 2025-08-19 | The Boeing Company | Systems and methods for deicing aircraft |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010063341A (en) * | 1999-12-22 | 2001-07-09 | 윤종용 | Device for heating wafer for semiconductor annealing process |
| US20010027969A1 (en) | 2000-04-06 | 2001-10-11 | Dainippon Screen Mfg. Co., Ltd. | Heat treatment apparatus |
| JP2003059853A (en) | 2001-08-08 | 2003-02-28 | Tokyo Electron Ltd | Lamp heater and heat treatment equipment |
| KR100729006B1 (en) | 1999-01-06 | 2007-06-14 | 스티그 알티피 시스템즈, 인코포레이티드 | Heating device for heating semiconductor wafers in thermal processing chambers |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5654904A (en) * | 1994-05-18 | 1997-08-05 | Micron Technology, Inc. | Control and 3-dimensional simulation model of temperature variations in a rapid thermal processing machine |
| US6108189A (en) * | 1996-04-26 | 2000-08-22 | Applied Materials, Inc. | Electrostatic chuck having improved gas conduits |
| US5781693A (en) * | 1996-07-24 | 1998-07-14 | Applied Materials, Inc. | Gas introduction showerhead for an RTP chamber with upper and lower transparent plates and gas flow therebetween |
| KR100203780B1 (en) * | 1996-09-23 | 1999-06-15 | 윤종용 | Heat treating apparatus for semiconductor wafer |
| US6164816A (en) * | 1998-08-14 | 2000-12-26 | Applied Materials, Inc. | Tuning a substrate temperature measurement system |
| JP2005222962A (en) * | 2000-04-20 | 2005-08-18 | Tokyo Electron Ltd | Heat treatment apparatus and method |
| US6376804B1 (en) * | 2000-06-16 | 2002-04-23 | Applied Materials, Inc. | Semiconductor processing system with lamp cooling |
| CN1299322C (en) * | 2000-11-16 | 2007-02-07 | 麦特逊技术股份有限公司 | Apparatuses and methods for resistively heating thermal processing system |
| US6344631B1 (en) * | 2001-05-11 | 2002-02-05 | Applied Materials, Inc. | Substrate support assembly and processing apparatus |
| US6570137B1 (en) * | 2002-03-04 | 2003-05-27 | Applied Materials, Inc. | System and method for lamp split zone control |
| US6818864B2 (en) * | 2002-08-09 | 2004-11-16 | Asm America, Inc. | LED heat lamp arrays for CVD heating |
| US7045746B2 (en) * | 2003-11-12 | 2006-05-16 | Mattson Technology, Inc. | Shadow-free shutter arrangement and method |
| KR20060076445A (en) * | 2004-12-29 | 2006-07-04 | 동부일렉트로닉스 주식회사 | Sputtering Equipment and Formation Method of Metal Silicide Film Using the Same |
| JP2006279008A (en) * | 2005-03-02 | 2006-10-12 | Ushio Inc | Heater and heating device provided with heater |
| KR100807120B1 (en) * | 2006-11-21 | 2008-02-27 | 코닉시스템 주식회사 | Rapid heat treatment device |
| US7923933B2 (en) * | 2007-01-04 | 2011-04-12 | Applied Materials, Inc. | Lamp failure detector |
| US8513626B2 (en) * | 2007-01-12 | 2013-08-20 | Applied Materials, Inc. | Method and apparatus for reducing patterning effects on a substrate during radiation-based heating |
| JP4935417B2 (en) * | 2007-02-26 | 2012-05-23 | ウシオ電機株式会社 | Light irradiation type heat treatment equipment |
| US7800081B2 (en) * | 2007-11-08 | 2010-09-21 | Applied Materials, Inc. | Pulse train annealing method and apparatus |
| CN101459041A (en) * | 2007-12-13 | 2009-06-17 | 中芯国际集成电路制造(上海)有限公司 | Updating method for fast heat treatment device |
| KR101382052B1 (en) * | 2009-09-11 | 2014-04-04 | 캐논 가부시끼가이샤 | Heater and phase heating device mounting this heater |
| US8637794B2 (en) * | 2009-10-21 | 2014-01-28 | Lam Research Corporation | Heating plate with planar heating zones for semiconductor processing |
| US9307578B2 (en) * | 2011-08-17 | 2016-04-05 | Lam Research Corporation | System and method for monitoring temperatures of and controlling multiplexed heater array |
-
2009
- 2009-08-21 KR KR1020090077425A patent/KR101031226B1/en active Active
-
2010
- 2010-08-04 US US13/391,410 patent/US8913884B2/en active Active
- 2010-08-04 WO PCT/KR2010/005119 patent/WO2011021796A2/en not_active Ceased
- 2010-08-04 CN CN201080040511.6A patent/CN102484896B/en active Active
- 2010-08-17 TW TW099127401A patent/TWI445435B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100729006B1 (en) | 1999-01-06 | 2007-06-14 | 스티그 알티피 시스템즈, 인코포레이티드 | Heating device for heating semiconductor wafers in thermal processing chambers |
| KR20010063341A (en) * | 1999-12-22 | 2001-07-09 | 윤종용 | Device for heating wafer for semiconductor annealing process |
| US20010027969A1 (en) | 2000-04-06 | 2001-10-11 | Dainippon Screen Mfg. Co., Ltd. | Heat treatment apparatus |
| JP2003059853A (en) | 2001-08-08 | 2003-02-28 | Tokyo Electron Ltd | Lamp heater and heat treatment equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9431279B2 (en) | 2012-05-18 | 2016-08-30 | Ap Systems Inc. | Heater block and a substrate treatment apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102484896A (en) | 2012-05-30 |
| WO2011021796A2 (en) | 2011-02-24 |
| TW201108846A (en) | 2011-03-01 |
| KR20110019840A (en) | 2011-03-02 |
| TWI445435B (en) | 2014-07-11 |
| CN102484896B (en) | 2014-06-25 |
| US20120207456A1 (en) | 2012-08-16 |
| US8913884B2 (en) | 2014-12-16 |
| WO2011021796A3 (en) | 2011-05-26 |
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