WO2008090733A1 - Semiconductor light reception element - Google Patents

Semiconductor light reception element Download PDF

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Publication number
WO2008090733A1
WO2008090733A1 PCT/JP2008/000045 JP2008000045W WO2008090733A1 WO 2008090733 A1 WO2008090733 A1 WO 2008090733A1 JP 2008000045 W JP2008000045 W JP 2008000045W WO 2008090733 A1 WO2008090733 A1 WO 2008090733A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
layer
mesa
selective etching
light reception
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/000045
Other languages
French (fr)
Japanese (ja)
Inventor
Takeshi Nakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2008554999A priority Critical patent/JP5109981B2/en
Priority to US12/524,059 priority patent/US8039918B2/en
Publication of WO2008090733A1 publication Critical patent/WO2008090733A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/20Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
    • H10F30/21Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
    • H10F30/22Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
    • H10F30/225Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier working in avalanche mode, e.g. avalanche photodiodes
    • H10F30/2255Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier working in avalanche mode, e.g. avalanche photodiodes in which the active layers form heterostructures, e.g. SAM structures

Landscapes

  • Light Receiving Elements (AREA)

Abstract

A semiconductor light reception element has a layered structure including a first conductive selective etching layer, a first conductive field-relaxing layer, a multiplication layer, a second conductive field-relaxing layer, a second conductive light-absorbing layer, a second conductive selective etching layer, a second conductive buffer layer, a second conductive contact layer, and a second conductive side electrode which are successively layered in this order on a semiconductor substrate. A second mesa is formed on the semiconductor substrate. On the second mesa is formed a first mesa. The first mesa includes a second conductive buffer layer, a second conductive contact layer, and a second conductive side electrode. The second mesa includes a first conductive layer, a multiplication layer, a second conductive light-absorbing layer, and a second conductive selective etching layer. In a plan view, the second mesa has an outer circumferential brim located outside the outer circumferential brim of the first mesa. The surfaces of the first mesa and the second mesa are covered with a passivation film.
PCT/JP2008/000045 2007-01-22 2008-01-18 Semiconductor light reception element Ceased WO2008090733A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008554999A JP5109981B2 (en) 2007-01-22 2008-01-18 Semiconductor photo detector
US12/524,059 US8039918B2 (en) 2007-01-22 2008-01-18 Semiconductor photo detector

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007011935 2007-01-22
JP2007-011935 2007-01-22

Publications (1)

Publication Number Publication Date
WO2008090733A1 true WO2008090733A1 (en) 2008-07-31

Family

ID=39644308

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000045 Ceased WO2008090733A1 (en) 2007-01-22 2008-01-18 Semiconductor light reception element

Country Status (3)

Country Link
US (1) US8039918B2 (en)
JP (1) JP5109981B2 (en)
WO (1) WO2008090733A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012132758A1 (en) * 2011-03-28 2012-10-04 三洋電機株式会社 Photoelectric conversion device and method for producing photoelectric conversion device
JP2019501535A (en) * 2016-09-20 2019-01-17 リミテッド ライアビリティ カンパニー デファン (エルエルシー デファン) Avalanche photodetector
JP2022164531A (en) * 2021-04-16 2022-10-27 聯亜光電工業股▲ふん▼有限公司 non-diffused photodiode
CN115425112A (en) * 2022-09-19 2022-12-02 中国电子科技集团公司第四十四研究所 A kind of highly reliable InP mesa photodetector and its preparation method
JP7615412B1 (en) * 2024-03-26 2025-01-16 三菱電機株式会社 Semiconductor photodetector, method of manufacturing semiconductor photodetector, optical line terminal, multilevel intensity modulation transmitter/receiver, digital coherent receiver, optical fiber radio system, SPAD sensor system, and lidar device

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US8868411B2 (en) * 2010-04-12 2014-10-21 Smule, Inc. Pitch-correction of vocal performance in accord with score-coded harmonies
JP5642593B2 (en) * 2010-05-18 2014-12-17 日本オクラロ株式会社 Back-illuminated semiconductor photo detector, optical receiver module, optical transceiver
US8330171B2 (en) * 2010-07-23 2012-12-11 Intel Corporation High speed, wide optical bandwidth, and high efficiency resonant cavity enhanced photo-detector
US9000783B2 (en) * 2010-08-02 2015-04-07 Wafertech, Llc Solid state sensor for metal ion detection and trapping in solution
GB2504977B (en) 2012-08-16 2017-10-04 Airbus Defence & Space Gmbh Laser power converter
US9209216B2 (en) 2013-08-07 2015-12-08 Globalfoundries Inc Passivation of back-illuminated image sensor
CN109309141A (en) * 2018-09-28 2019-02-05 苏州大学 InGaAs-InP based heterojunction phototransistors
CN109216495B (en) * 2018-10-24 2023-12-29 芯思杰技术(深圳)股份有限公司 Avalanche photodetector, manufacturing method and laser radar system
RU2732694C1 (en) * 2019-03-12 2020-09-21 Общество С Ограниченной Ответственностью "Детектор Фотонный Аналоговый" (Ооо "Дефан") Avalanche photodetector (embodiments) and method of manufacturing thereof (embodiments)
US11056604B1 (en) * 2020-02-18 2021-07-06 National Central University Photodiode of avalanche breakdown having mixed composite charge layer
CN114220877A (en) * 2021-11-27 2022-03-22 苏州大学 Up-conversion device based on near-infrared photoelectric detector and OLED and manufacturing method thereof
US20240105752A1 (en) * 2022-09-22 2024-03-28 Sumitomo Electric Industries, Ltd. Light receiving element and light detector

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06314813A (en) * 1993-03-04 1994-11-08 Sumitomo Electric Ind Ltd P-i-n photosensitive element, its manufacture and photoelectronic integrated circuit
JP2001177143A (en) * 1999-12-17 2001-06-29 Hitachi Ltd Semiconductor light receiving device and manufacturing method
JP2001196623A (en) * 2000-01-14 2001-07-19 Matsushita Electric Ind Co Ltd Semiconductor device, method of manufacturing semiconductor device, method of manufacturing mounted body, and mounted body
WO2006123410A1 (en) * 2005-05-18 2006-11-23 Mitsubishi Denki Kabushiki Kaisha Avalanche photo diode

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2474560C (en) 2002-02-01 2012-03-20 Picometrix, Inc. Planar avalanche photodiode

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06314813A (en) * 1993-03-04 1994-11-08 Sumitomo Electric Ind Ltd P-i-n photosensitive element, its manufacture and photoelectronic integrated circuit
JP2001177143A (en) * 1999-12-17 2001-06-29 Hitachi Ltd Semiconductor light receiving device and manufacturing method
JP2001196623A (en) * 2000-01-14 2001-07-19 Matsushita Electric Ind Co Ltd Semiconductor device, method of manufacturing semiconductor device, method of manufacturing mounted body, and mounted body
WO2006123410A1 (en) * 2005-05-18 2006-11-23 Mitsubishi Denki Kabushiki Kaisha Avalanche photo diode

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012132758A1 (en) * 2011-03-28 2012-10-04 三洋電機株式会社 Photoelectric conversion device and method for producing photoelectric conversion device
JP2019501535A (en) * 2016-09-20 2019-01-17 リミテッド ライアビリティ カンパニー デファン (エルエルシー デファン) Avalanche photodetector
JP2022164531A (en) * 2021-04-16 2022-10-27 聯亜光電工業股▲ふん▼有限公司 non-diffused photodiode
US11699771B2 (en) 2021-04-16 2023-07-11 Landmark Optoelectronics Corporation Non-diffusion type photodiode
CN115425112A (en) * 2022-09-19 2022-12-02 中国电子科技集团公司第四十四研究所 A kind of highly reliable InP mesa photodetector and its preparation method
JP7615412B1 (en) * 2024-03-26 2025-01-16 三菱電機株式会社 Semiconductor photodetector, method of manufacturing semiconductor photodetector, optical line terminal, multilevel intensity modulation transmitter/receiver, digital coherent receiver, optical fiber radio system, SPAD sensor system, and lidar device
WO2025203206A1 (en) * 2024-03-26 2025-10-02 三菱電機株式会社 Semiconductor light-receiving element, method for manufacturing semiconductor light-receiving element, optical-line-terminating device, multi-value intensity modulation transmission/reception device, digital coherent reception device, optical fiber radio system, spad sensor system, and lidar device
JP2025149869A (en) * 2024-03-26 2025-10-08 三菱電機株式会社 Semiconductor photodetectors, optical line terminals, multilevel intensity modulation transmitters and receivers, digital coherent receivers, radio-over-fiber systems, SPAD sensor systems, and lidar devices
JP7774702B2 (en) 2024-03-26 2025-11-21 三菱電機株式会社 Semiconductor photodetectors, optical line terminals, multilevel intensity modulation transmitters and receivers, digital coherent receivers, radio-over-fiber systems, SPAD sensor systems, and lidar devices

Also Published As

Publication number Publication date
US20100019275A1 (en) 2010-01-28
JP5109981B2 (en) 2012-12-26
JPWO2008090733A1 (en) 2010-05-20
US8039918B2 (en) 2011-10-18

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