EP0358480A3 - Process for producing multilayer printed wiring board - Google Patents

Process for producing multilayer printed wiring board Download PDF

Info

Publication number
EP0358480A3
EP0358480A3 EP19890309018 EP89309018A EP0358480A3 EP 0358480 A3 EP0358480 A3 EP 0358480A3 EP 19890309018 EP19890309018 EP 19890309018 EP 89309018 A EP89309018 A EP 89309018A EP 0358480 A3 EP0358480 A3 EP 0358480A3
Authority
EP
European Patent Office
Prior art keywords
printed wiring
wiring board
multilayer printed
internal layer
copper surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19890309018
Other languages
German (de)
French (fr)
Other versions
EP0358480B1 (en
EP0358480A2 (en
Inventor
Yasuo Mitsubishi Gas Chemical Co. Inc. Tanaka
Naohito Mitsubishi Gas Chemical Co. Inc Yoshimura
Koichi Mitsubishi Gas Chemical Co. Inc Nakano
Touru Mitsubishi Gas Chemical Co. Inc Nohtomi
Morio Mitsubishi Gas Chemical Co. Inc Gaku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63221374A external-priority patent/JPH0271587A/en
Priority claimed from JP63221373A external-priority patent/JPH0271586A/en
Priority claimed from JP63282364A external-priority patent/JPH02129996A/en
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Publication of EP0358480A2 publication Critical patent/EP0358480A2/en
Publication of EP0358480A3 publication Critical patent/EP0358480A3/en
Application granted granted Critical
Publication of EP0358480B1 publication Critical patent/EP0358480B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63—Treatment of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A process for producing a multilayer printed wiring board, characterized in that copper surface of internal layer(s) is chemically oxidized, thereby forming a brown or black, oxidized copper surface on the internal layer board; and said oxidized copper surface of said internal layer board is treated with an acidic aqueous solution of a reducing agent containing at least one material selected from the group consisting of zinc formaldehyde sulfoxylate and sodium hypophosphite.
EP89309018A 1988-09-06 1989-09-06 Process for producing multilayer printed wiring board Expired - Lifetime EP0358480B1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP221373/88 1988-09-06
JP63221374A JPH0271587A (en) 1988-09-06 1988-09-06 Manufacturing method of multilayer printed board
JP63221373A JPH0271586A (en) 1988-09-06 1988-09-06 Manufacture of multilayer printed board
JP221374/88 1988-09-06
JP63282364A JPH02129996A (en) 1988-11-10 1988-11-10 Manufacturing method of multilayer printed board
JP282364/88 1988-11-10

Publications (3)

Publication Number Publication Date
EP0358480A2 EP0358480A2 (en) 1990-03-14
EP0358480A3 true EP0358480A3 (en) 1991-04-10
EP0358480B1 EP0358480B1 (en) 1995-01-04

Family

ID=27330542

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89309018A Expired - Lifetime EP0358480B1 (en) 1988-09-06 1989-09-06 Process for producing multilayer printed wiring board

Country Status (5)

Country Link
US (1) US5076864A (en)
EP (1) EP0358480B1 (en)
KR (1) KR970004029B1 (en)
DE (1) DE68920383T2 (en)
MY (1) MY104191A (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0469470B1 (en) * 1990-07-30 1996-10-09 Mitsubishi Gas Chemical Company, Inc. Process for producing multilayered printed board
DE69112181T2 (en) * 1990-11-30 1996-05-09 Toppan Printing Co Ltd Method of manufacturing a multilayer wiring board.
US5289630A (en) * 1991-07-22 1994-03-01 Macdermid, Incorporated Process for fabricating multilayer printed circuits
US5286530A (en) * 1993-01-13 1994-02-15 General Electric Company Method for providing adherent metal coatings on cyanate ester polymer surfaces
JP2694802B2 (en) * 1993-12-28 1997-12-24 日本電気株式会社 Manufacturing method of printed wiring board
KR100906931B1 (en) 1998-02-26 2009-07-10 이비덴 가부시키가이샤 Multilayer printed wiring board having filled-via structure
US6294220B1 (en) 1999-06-30 2001-09-25 Alpha Metals, Inc. Post-treatment for copper on printed circuit boards
JP3067021B2 (en) * 1998-09-18 2000-07-17 インターナショナル・ビジネス・マシーンズ・コーポレ−ション Method for manufacturing double-sided wiring board
JP4287622B2 (en) * 2002-06-28 2009-07-01 デュポン帝人アドバンスドペーパー株式会社 COATING SEPARATOR, MANUFACTURING METHOD THEREOF, AND ELECTRIC AND ELECTRONIC COMPONENT USING THE SAME
US6986023B2 (en) * 2002-08-09 2006-01-10 Intel Corporation Conditional execution of coprocessor instruction based on main processor arithmetic flags
TW573327B (en) * 2002-12-27 2004-01-21 Ultratera Corp Plasma etching method
JP4784066B2 (en) * 2004-10-28 2011-09-28 三菱瓦斯化学株式会社 Resin composition and copper clad laminate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0189913A1 (en) * 1985-01-31 1986-08-06 Hitachi, Ltd. Method of bonding copper and resin
WO1987002856A1 (en) * 1985-10-24 1987-05-07 Enthone, Incorporated Copper oxide treatment in printed circuit board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4775444A (en) * 1987-08-26 1988-10-04 Macdermid, Incorporated Process for fabricating multilayer circuit boards

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0189913A1 (en) * 1985-01-31 1986-08-06 Hitachi, Ltd. Method of bonding copper and resin
WO1987002856A1 (en) * 1985-10-24 1987-05-07 Enthone, Incorporated Copper oxide treatment in printed circuit board

Also Published As

Publication number Publication date
EP0358480B1 (en) 1995-01-04
US5076864A (en) 1991-12-31
DE68920383T2 (en) 1995-06-01
KR970004029B1 (en) 1997-03-24
EP0358480A2 (en) 1990-03-14
MY104191A (en) 1994-02-28
DE68920383D1 (en) 1995-02-16
KR900005860A (en) 1990-04-14

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