MY104191A - Process for producing multilayer printed wiring board - Google Patents

Process for producing multilayer printed wiring board

Info

Publication number
MY104191A
MY104191A MYPI89001201A MYPI19891201A MY104191A MY 104191 A MY104191 A MY 104191A MY PI89001201 A MYPI89001201 A MY PI89001201A MY PI19891201 A MYPI19891201 A MY PI19891201A MY 104191 A MY104191 A MY 104191A
Authority
MY
Malaysia
Prior art keywords
printed wiring
wiring board
multilayer printed
internal layer
copper surface
Prior art date
Application number
MYPI89001201A
Inventor
Nohtomi Touru
Yoshimura Naohito
Nakano Koichi
Gaku Morio
Tanaka Yasuo
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63221374A external-priority patent/JPH0271587A/en
Priority claimed from JP63221373A external-priority patent/JPH0271586A/en
Priority claimed from JP63282364A external-priority patent/JPH02129996A/en
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of MY104191A publication Critical patent/MY104191A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63—Treatment of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A PROCESS FOR PRODUCING A MULTILAYER PRINTED WIRING BOARD, CHARACTERIZED IN THAT COPPER SURFACE OF INTERNAL LAYER(S) IS CHEMICALLY OXIDIZED, THEREBY FORMING A BROWN OR BLACK, OXIDIZED COPPER SURFACE ON THE INTERNAL LAYER BOARD; AND OXIDIZED COPPER SURFACE OF SAID INTERNAL LAYER BOARD IS TREATED WITH AN ACIDIC AQUEOUS SOLUTION OF A REDUCING AGENT CONTAINING AT LEAST ONE MATERIAL SELECTED FROM THE GROUP CONSISTING OF ZINE FORMALDEHYDE SULFOXYLATE AND SODIUM HYPOPHOSPHITE.
MYPI89001201A 1988-09-06 1989-09-05 Process for producing multilayer printed wiring board MY104191A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP63221374A JPH0271587A (en) 1988-09-06 1988-09-06 Manufacturing method of multilayer printed board
JP63221373A JPH0271586A (en) 1988-09-06 1988-09-06 Manufacture of multilayer printed board
JP63282364A JPH02129996A (en) 1988-11-10 1988-11-10 Manufacturing method of multilayer printed board

Publications (1)

Publication Number Publication Date
MY104191A true MY104191A (en) 1994-02-28

Family

ID=27330542

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI89001201A MY104191A (en) 1988-09-06 1989-09-05 Process for producing multilayer printed wiring board

Country Status (5)

Country Link
US (1) US5076864A (en)
EP (1) EP0358480B1 (en)
KR (1) KR970004029B1 (en)
DE (1) DE68920383T2 (en)
MY (1) MY104191A (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0469470B1 (en) * 1990-07-30 1996-10-09 Mitsubishi Gas Chemical Company, Inc. Process for producing multilayered printed board
DE69112181T2 (en) * 1990-11-30 1996-05-09 Toppan Printing Co Ltd Method of manufacturing a multilayer wiring board.
US5289630A (en) * 1991-07-22 1994-03-01 Macdermid, Incorporated Process for fabricating multilayer printed circuits
US5286530A (en) * 1993-01-13 1994-02-15 General Electric Company Method for providing adherent metal coatings on cyanate ester polymer surfaces
JP2694802B2 (en) * 1993-12-28 1997-12-24 日本電気株式会社 Manufacturing method of printed wiring board
KR100906931B1 (en) 1998-02-26 2009-07-10 이비덴 가부시키가이샤 Multilayer printed wiring board having filled-via structure
US6294220B1 (en) 1999-06-30 2001-09-25 Alpha Metals, Inc. Post-treatment for copper on printed circuit boards
JP3067021B2 (en) * 1998-09-18 2000-07-17 インターナショナル・ビジネス・マシーンズ・コーポレ−ション Method for manufacturing double-sided wiring board
JP4287622B2 (en) * 2002-06-28 2009-07-01 デュポン帝人アドバンスドペーパー株式会社 COATING SEPARATOR, MANUFACTURING METHOD THEREOF, AND ELECTRIC AND ELECTRONIC COMPONENT USING THE SAME
US6986023B2 (en) * 2002-08-09 2006-01-10 Intel Corporation Conditional execution of coprocessor instruction based on main processor arithmetic flags
TW573327B (en) * 2002-12-27 2004-01-21 Ultratera Corp Plasma etching method
JP4784066B2 (en) * 2004-10-28 2011-09-28 三菱瓦斯化学株式会社 Resin composition and copper clad laminate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61176192A (en) * 1985-01-31 1986-08-07 株式会社日立製作所 Adhesion between copper and resin
US4717439A (en) * 1985-10-24 1988-01-05 Enthone, Incorporated Process for the treatment of copper oxide in the preparation of printed circuit boards
US4775444A (en) * 1987-08-26 1988-10-04 Macdermid, Incorporated Process for fabricating multilayer circuit boards

Also Published As

Publication number Publication date
EP0358480B1 (en) 1995-01-04
US5076864A (en) 1991-12-31
EP0358480A3 (en) 1991-04-10
DE68920383T2 (en) 1995-06-01
KR970004029B1 (en) 1997-03-24
EP0358480A2 (en) 1990-03-14
DE68920383D1 (en) 1995-02-16
KR900005860A (en) 1990-04-14

Similar Documents

Publication Publication Date Title
MY125599A (en) Printed circuit boards and method of producing the same
MY104191A (en) Process for producing multilayer printed wiring board
DE3270926D1 (en) Process of treating anodic oxide film, printed wiring board and process of making the same
EP0398721A3 (en) Thin copper foil for printed wiring board and method of manufacturing same
EP0053272A3 (en) Multilayer printed-circuit board, and method of establishing the actual position of internal contact areas
JPS6457789A (en) Electronic component mounting structure
EP0059434A3 (en) Multi-layer printed circuit board and process for production thereof
EP0243507A4 (en) Flexible laminate for printed circuit board and process for its production.
KR910007395A (en) Printed circuit board, manufacturing method and apparatus therefor
ATE66498T1 (en) PROCESS FOR MANUFACTURING PRINTED CIRCUIT BOARDS.
EP0621746A3 (en) Composite printed circuit board and manufacturing method thereof.
EP0425703A4 (en) Photo-curable resin laminate and method of producing printed wiring board using the same
HUT59185A (en) Eletrolytically detached foil with controlled properties, suitable for being used at printed circuits, processes for producing such foil and electrolysis bath solutions
MY106538A (en) Copper foil for inner layer circuit of multi-layered printed circuit board, method of producing the same and multi-layered printed circuit board having the same.
JPS6480094A (en) Printed wiring board
KR950024971A (en) Chemical Reduction Liquid for Copper Oxide
KR890701364A (en) Pad printing device for transferring a precisely limited amount of printing medium per unit surface
KR960030756A (en) Printed wiring board and its forming method
GB2324753B (en) Printed circuit and printed wiring boards and methods of manufacture
DE3373775D1 (en) Multilayer printed circuit board, and method of manufacturing multilayer printed circuit boards
EP0224922A3 (en) Invar foil
JPS6489590A (en) Arrangement of electronic component
JPS6484788A (en) Printed wiring board
KR920005462B1 (en) Flexible printed wiring board with multilayered pattern and manufacturing process
JPS6489392A (en) Manufacture of printed wiring board